1. The equipment is mainly used for dismantling and welding the surface
mount of electronic components
Such as: SOIC, CHIP, QFP, PLCC, BGA, etc.
2. Used for disassembly and welding of mobile phone wiring and wiring
holder.
3. It can be used for heating, drying, removing paint, removing glue, thawing,
bonding, thermal testing and other processes that need heating for heat
shrinkable hose and various plastics.
After receiving this product, please open the package and check whether
the following basic accessories are missing. There are many types of weld-
ing table, different types of accessories will increase or decrease, please
consult with local vendors.
1. This equipment adopts resistance wire heating, K-type thermocouple
sensing closed loop microcomputer PID full program temperature control. It
has advanced prediction, accurate temperature control, multiple fault indica-
tion and safety protection measures. Temperature constant temperature
accuracy is not more than ±2 degrees, linear distortion <±3 .
2. Air volume air supply adopts high-performance double ball vortex fan,
which has the characteristics of low noise, light weight, large air volume, high
wind pressure, long service life and so on. Air volume size can be adjusted,
air volume adjustment range: 5%-100%.
3. The handle is fitted with an induction switch and can be removed from the
bracket to quickly enter the working mode. When the handle is placed in the
handle holder, the system will cool down and send cold air to the standby
state. Real-time operation is convenient, save less energy loss and prolong
I. Functional uses
II . Packing List Attachment:
Ⅲ . Product performance description
1 pcs
1 pcs
1 pcs
1 pcs 1 pcs
3 pcs（¢6，¢8，¢10）
The host
Nozzle
AC power cable
Desoldering station Handle bracket
IC extractor
1 pcs
1 pcs 1 pcs
Soldering iron handle (2-in-1 model)
High temperature absorbent
sponge (2-in-1 model)
Soldering iron handle (2-in-1 model)
Instructions
To Next Page
Loading...