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7-4. Disassembly
※ C a u tio n
1) Be care of scratch
※ C a u tio n
1) Be care of scratch
※ C a u tio n
1) Be care of Rear damage
※ C a u tio n
1) Be care of Rear and connector damage
1
2
Unscrew 15 Point and disassemble SIM Tray1,
2 from device.
3
Disassemble Upper/Middle Rear.(Use disassemble
hole left side of Rear to detach it)
4
Finally Disassemble Rear of bottom side.
(Use disassemble hole left side of Rear to detach it)
: Put the device in the chamber
for 10~20 minutes under 70℃.
2) SOC 68% : Put the device in the chamber for
10~20 minutes under 60℃.
3) Detach the Back Glass.