SenseAir S8 Series User Manual

Handling Manual
Senseair S8
Miniature CO
2
sensor module with NDIR technique
Document Rev Page
ANO0102 5 1 (2)
NOTE:
ESD sensitive product.
Use ESD protection equipment.
NOTE:
Handle sensor by holding PCB only.
Never touch sensor with bare hands! Use clean gloves
to avoid dust, grease or other contaminations.
OBA shall not be subjected to any force.
Particle lter
NOTE:
To ensure airflow, and quick sensor response time to changes
in environment: do not block particle filter!
Installation and soldering
See IPC-J-STD-001 for acceptable soldering conditions in general.
Selective soldering machine (drag soldering method): soldering temperature 295°C during three seconds.
Hand soldering: soldering iron temperature 380°C during two seconds/pin.
Mechanical properties
Please refer to mechanical drawing of detailed specification regarding dimensions and tolerances.
Layout considerations:
Use cut-outs or slits in main board to reduce mechanical stress to sensor due to board thermal expansion.
To ensure stability, do install pin headers on boath sides of sensor.

SenseAir S8 Series Specifications

General

Operating Temperature	0 to 50 °C
Gas Type	Carbon Dioxide (CO2)
Sensing Method	NDIR (Non-Dispersive Infrared)
Measurement Range	0-5000 ppm
Accuracy	± (30 ppm + 3% of reading)
Operating Humidity	0 to 95% RH (non-condensing)
Power Supply	4.5 - 5.5 VDC
Storage Temperature	-20°C to +60°C
Output	UART
Lifetime	15 years
Power Consumption	18 mA (average at 3.3 VDC)

Summary

Installation and Soldering

Selective Soldering Conditions

Drag soldering: 295°C for three seconds.

Hand Soldering Conditions

Manual soldering: 380°C for two seconds per pin.

Mechanical Properties and Layout

Mechanical Properties Reference

Refer to mechanical drawing for dimensions and tolerances.

Layout for Thermal Expansion

Use cut-outs/slits to reduce stress from board thermal expansion.

Layout for Sensor Stability

Install pin headers on both sides for stability.

Handling Precautions and Distances

OBA Handling Restrictions

No gluing or moulding on OBA.

OBA to Cover Clearance

Maintain ≥1.0mm minimum distance from OBA to cover/PCB.

Particle Filter Clearance

Maintain ≥1.5mm minimum distance from particle filter to cover/PCB.

Storage and Verification

Storage Requirements

Store in sealed ESD bags at -40-70°C in normal IAQ environments.

Post-Transport Calibration

Inspect and perform zero calibration after transport.