Information and Communication Mobile
Mobile Phones
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ICM MP CCQ GRM
M55/M56
Company Confidential
Copyright 2003© Siemens AG
05/03
7.4 Repair Documentation:
7.4.1 Description of procedure:
7.4.1.1 Diagnosis:
Visually check the status of the board connector. Watch for oxidation and dry
solder joints.
7.4.1.2 Repair by component change:
Use soldering iron to remove defective diode.
Avoid excessive heat!
Watch surrounding components!!
Resolder new connector afterwards.
7.4.1.3 Repair by Software booting:
Not possible!
7.4.1.4 Test:
Retest handset after repair.
7.4.2 List of needed material:
7.4.2.1 Components:
Board connector M55/M56
Part-Number: L36334-Z97-C162