12
D-NE730/NE730LS/NE830/NE830LS
SECTION 6
DIAGRAMS
Note on Printed Wiring Boards.
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
• : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
Caution:
Pattern face side: Parts on the pattern face side seen from
(Side B) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Side A) the parts face are indicated.
• These boards are multi-layer printed board. However, the paterns
of intermediate-layer have not been included in the diagram.
•Waveforms
– MAIN Board –
Note on Schematic Diagrams.
• All capacitors are in µF unless otherwise noted. (p: pF) 50 WV or
less are not indicated except for electrolytics and tantalums.
• All resistors are in Ω and
1
/
4
W or less unless otherwise specified.
• f : internal tolerance.
• C : panel designation.
• A : B+ Line.
•Total current is measured with CD installed.
•Power voltage is dc 1.5 V and fed with regulated dc power supply
from battery terminals.
•Voltages and waveforms are dc with respect to ground in playback
mode.
no mark : CD PLAY
∗ : Impossible to measure
•Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal production toler-
ances.
•Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production toler-
ances.
• Circled numbers refer to waveforms.
• Signal path.
J : CD
Note: The components identified by mark 0 or dotted
line with mark 0 are critical for safety.
Replace only with part number specified.
600 mVp-p
1 TP604 (RF)
1.4 Vp-p
2 IC801
th
EXTAL
45.4 ns
200 mV/DIV, 400 ns/DIV
1 V/DIV, 20 ns/DIV
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