2
ICD-SX25/SX25VTP
TABLE OF CONTENTS
1. GENERAL ................................................................... 3
2. DISASSEMBLY
2-1. Disassembly Flow ........................................................... 4
2-2. Cover (jack) ..................................................................... 4
2-3. Case Block Assy .............................................................. 5
2-4. AUDIO Board, Microphone Unit (MIC2/3).................... 5
2-5. Ornament Belt, SW Board............................................... 6
2-6. Cover (chassis) Block Assy ............................................. 6
2-7. MAIN Board, Liquid Crystal Display Panel ................... 7
3. TEST MODE ............................................................... 8
4. DIAGRAMS
4-1. Block Diagrams – MAIN Section-1 – ............................ 12
4-2. Block Diagrams – MAIN Section-2 – ............................ 13
4-3. Block Diagrams – PANEL Section – ............................. 14
4-4. Printed Wiring Board – MAIN Board – ......................... 15
4-5. Schematic Diagram – MAIN Board (1/2) – ................... 16
4-6. Schematic Diagram – MAIN Board (2/2) – ................... 17
4-7. Printed Wiring Board – AUDIO Board – ....................... 18
4-8. Schematic Diagram – AUDIO Board (1/2) – ................. 19
4-9. Schematic Diagram – AUDIO Board (2/2) – ................. 20
4-10. Printed Wiring Board – SW Board – .............................. 21
4-11. Schematic Diagram – SW Board –................................. 22
5. EXPLODED VIEWS
5-1. Case Block Assy .............................................................. 30
5-2. Chassis Block Assy ......................................................... 31
6. ELECTRICAL PARTS LIST .................................. 32
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 °C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
✩ Replacement of IC6001 and IC7003 used in this set requires
a special tool.
•The voltage and waveform of CSP (chip size package) cannot
be measured, because its lead layout is different from that of
conventional IC.
• Lead layouts
surface
Lead layout of
conventional IC
CSP (chip size package)
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder. Operating instructiondd
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