Sony TCM-5000EV - Chip Component Handling Procedures

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TCM-SOOOEV
Replacing chip co mponents
All chip components should be connected and disconnect-
ed, us'.ng a tapered soldering iron [ temperature of the iron
tip: less
than 280°C (536 ° F)I , a pair of tweezers and braid-
ed wire.
Pr ecautions for replacement
I . Do n ot discon ne ct the ch ip co mponent fo r cef ull y.
Ot h erw ise, the p atte rn m ay p eel off.
2. Never re-use a disco
nne cted chip compo ne nt . Dis po se of
all o
ld chip com ponents.
3.
To pro t ect the ch ip compo n en t, heatina time for a tt ac h-
in fl th e compone nt should be w ith in 3 seco nd s.
o Remov in g chip componen ts
(I) Removing solder at el ect r ode
Remove the solder at the electrode, using a thin
braided wire. Do not remove the solder of the part
(chip component) attached adjacent to the electrode.
Pattern
Soldering iron
(2) Di sco n nec ting chip co mp on ents
Turn the tweezers with the soldering iron alternately
applied to both electrodes, and the chip component
will be disconnected. Take careful precautions while
disconnecting, because
if the chip component is force-
fully removed
the land may peel off.
Never re-use a disconnected chip component.
- 4 -
(3) Sm oo t hi ng the so ldered surface
After disconnecting the chip component, remove the
solder by using a braided wire to smooth the land
surface.
o Connecting chip component s
The value of chip components is not displ ayed on the
main body. Take d ue pr ecautions to avoid mixing new
chip components with other ones.
(1) A
pp lying so lder to lan d on o ne side
Apply a
thin layer of so l der to the land on one side
where the chip component is to be connected. Too
much solder may cause bridging.
(2) Speedy so lde ri ng
Hold the chip component at the desired position,
using tweezers,
and apply the soldering iron in the
arrow-marked direction. To protect the chip compo-
nent, heating time should be within 3 seconds.
Land Prin red circuit board
(3) Speedy sold eri ng of el ect rode on th e ot her side
Solder
the electrode on t he other side in the same
way as
in (2) above.
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