Sony TCM-8EV - Page 28

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y
.,
TCM-BEV
1
US
model: 16,001 and later
Canadian model: 10,301 and later
2
3
4
AEP model: 13,701 and later
E model: 14,801 and later
5
6
MOUNTING
DIAGRAM
• Refer
to
page
3
for
semiconductors
lead
layout.
A
0
IC
0
B
C
D
E
F
G
H
IC202
IC201
[BBD
OOARD)
1B
SIDE)
203
IC202
IC201
[VOR
OOARO]
(A
SIDE)
[ BBD
OOARD]
(A
SIDE)
.
\
[VOR
BOARD)
(B
SIDE)
\
(SPEED
CONIBOL.
BOARD]
(A
SIDE)
306
301
304
7
307
309
8
303
·
305
9
US
model: 16,001 and later
Canadian model: 10,301 and later
10
11
202
IC301
204
205
YOR
REC
MOOE
ruin~~
',ORRe:;..ioE
n
n
Fl
n
-:-!
J
LJ
•.
LJ
LJ!l\'/-P
AEP model:
12
201
/ model:
VOR
fE£
Ka
I
ro,.,c
I
7
2.8\l>i>
_J
13,701 and later
14,801 and later
13
14
301
TCM-BEV
(
TCM-BEV
15
16
17
601
IOI
· IC601
1
03
102
------
[ill
US model: 16,001 and later
Canadian model: 10,301 and later
ICI0I
18
MRP
901
PP
1
3•
- l
6T
RB:/P8
"°'°
19
102
lt)'llU.QllREIIT
FWD
1
07111il
ffJm
AEP model: 13,701 and later
E model: 14,801 and later
20
21
IOI
CN
IOI
~
1,__--
-
-------------
+-
--------------------------------
-
-----
----
--
--
---
---'----<e
,9)-
--
-----
---
----
- -
----------'
•
Color
code
of
s eeving over
the
end
of
the
jacket.
•
o--
:
parts extracted
from
the
component
side.
•
,,:::\,ec:,:'
, :
component-side pattern.
• - : parts extracted
from
the
conductor
side.
• \;/C-:' :
B
+
pattern
J
•
■
:
part
mounted
on
the
conductor
side.
• -
+-
:
signal path
• ® :
Through
hole.
•
---
:
Through
hole connection.
-4-
- 5-
-6-
22
23
0
A
IC
0
B
C
D
E
F
G
,
102
~
H
J