ST ST7735R - 3.4 Chip Information

ST7735R
V0.2 5 2009-08-05
3.4 Chip Information
Chip size (um x um): 10080 x 670
PAD coordinate: pad center
Coordinate origin: chip center
Chip thickness (um): 300(TYP)
Bump height (um): 15(TYP)
Bump hardness (HV): 75(TYP)
No.1
No.185
No.186
No.759