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Tandberg Data TDC 3640 - Default Chapter; Table of Contents

Tandberg Data TDC 3640
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Table of Contents
o.
1.
1.1.
1.2.
1.3.
2.
2.1.
2.2.
2.3.
2.4
2.5.
2.6.
3.
31.
3.2.
3.3.
3.31.
3.3.2.
3.33
3.34.
3.3.5.
34.
3.4.1.
3.4.2.
3.4.3.
3.4.4.
3.4.5.
3.4.6.
3.5.
3.5.1.
3.5.2.
3.5.3.
3.6.
3.6.1.
3.6.2.
3.6.3.
3.6.4.
3.6.5.
3.6.6.
3.6.7.
3.6.8.
3.6.9.
3.6.10.
4.
4.1.
4.2.
4.2.1.
4.2.2.
4.2.3.
4.2.4.
4.2.5.
4.3.
4.4.
Preface ....................................................................................................................
0·1
,
About
this
Manual ..................................................................................................
1·1
Definitions
........................................................................................................... 1
·1
Introduction
to
this
Manual
..................................................................................
1-'
Additional
Documentation
...................................................................................
'·2
Introduction
to
the Drive .......................................................................................
2·1
Summary
.............................................................................................................
2·'
General
Drive
Description ...................................................................................
2·1
Tape
Format
and
Drive
Operation
...................................................................... 2·3
Drive
Block
Diagram
with
Description
................................................................. 2·5
The
Formatter
Functions
.................................................................................... 2·6
Interface
to
Host
.......... .............. ............................................ ................... ..........
2-7
Ffroduct Specifications ..........................................................................................
3·1
Mechanical
Dimensions
and
Weight
...................................................................
3-1
Power
Requirements
..........................................................................................
3-1
Environmental
Specifications .............................................................................. 3·2
Temperature
and
Relative
Humidity
.............................................................. 3·2
Temperature
Variation
...................................................................................
3-3
Atmospheric
Pressure
....................................................................................
3·3
Vibration
......................................................................................................... 3·3
Impact
and
Shock
.......................................................................................... 3-3
Product
Performance
Specifications
................................................................... 3-4
Audible
Noise
................................................................................................. 3-4
Radiated
Electromagnetic Interference .......................................................... 3-4
Susceptibility
to
Electromagnetic
Interference
............................................... 3-4
Static
Discharge
............................................................................................. 3-4
Safety
Standard
............................................................................................. 3-4
Mean
Time
to
Repair
..................................................................................... 3-4
Product
Reliability ............................................................................................... 3·5
Electronics
MTBF
...........................................................................................
3-5
Mechanics
MTTF
....
........................ ........
......
.................. ........ ..................
.....
3-5
Useful
life
Cycle
............................................................................................
3-5
Functional
Specifications .................................................................................... 3-6
Media
............................................................................................................. 3-6
Track
Width
and
location .............................................................................. 3-6
Head
Specifications .......................................................................................
3-9
Tape
Movement
.............................................................................................
3-9
Recording
Specifications ............................................................................. 3·10
Storage
Capacity
.........................................................................................
3-11
Head
Moving
Mechanism
............................................................................
3-11
Capstan
System
..........................................................................................
3-11
Tape
Sensor
System
...................................................................................
3-11
Electronics ................................................................................................... 3-12
Mounting Specifications ....................................................................................... 4·1
General
Mounting Information .............................................................................
4-1
Strap
Setting/Selecting
Drive
Number
................................................................ 4-3
Selecting
Drive
Number
................................................................................. 4·3
EnablelDisable
Bus
Parity
Checking
............................................................. 4-4
External SCSI·bus
Termination
.....................................................................
4-4
Serialln/Out
Communication
......................................................................... 4·5
Test
Functions ............................................................................................... 4·5
SCSI·Bus Interface Configuration .......................................................................
4-6
Heat
Dissipation ..................................................................................................
4-7
i

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