3-6 TM109902 (5/03)
USE OR DISCLOSURE OF DATA CONTAINED ON THIS PAGE IS SUBJECT TO THE
RESTRICTION ON THE TITLE PAGE OF THIS DOCUMENT.
C OMMAND S YSTEMS D IVISION
Do not wear ground strap when troubleshooting
or testing high voltage circuits with power
applied.
Do not wear smocks, gloves, finger cots, or sleeve protectors made of plastic, nylon, or
rubber in the area where ESDS devices are handled.
When the operator is properly grounded, contact with the operator's hand will provide
sufficient ground for hand tools or other tools that many be electrically isolated from
ground.
(4) Special Troubleshooting Precautions
In addition to the above considerations, the following specific precautions should be
observed when troubleshooting or repairing modules containing ESDS devices.
Do not use high velocity dry air for applying heat during troubleshooting. Special infrared
heat devices should be used.
Do not use Freon spray during troubleshooting. To cool components, use antistatic quick-
chill sprays.
Remember, even when the ESDS device is installed on a printed circuit board it can STILL
be damaged by electrostatic discharge.
C. Printed Circuit Boards
Components on the PC boards can be replaced, reference should be made to the applicable
Repair paragraph for replacement and removal of components. All PC boards have been
protected with a moisture protected sealant. A sealant such as “Humi Seal Protective Coating
1831” should be re-applied to the repaired area.
“Humi Seal Protective Coating 1B31” is manufactured by the Humi Seal Division of the
Columbia Technical Corporation, Woodside, New York 11377.
D. Components Replacement, Feed-Thru Capacitors or Filters
(1) From both sides of chassis, remove components connected to the feed-thru; clear
disconnected components from the vicinity of the feed-thru.
(2) Locate side of chassis on which feed-thru rim is mounted.
(3) Unsolder component (use a 250 watt five tipped soldering iron) by heating the chassis near
the component.
WARNING
The document reference is online, please check the correspondence between the online documentation and the printed version.
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