Telephonics RT-1601 User Manual

TM109902 (5/03) 3-1
USE OR DISCLOSURE OF DATA CONTAINED ON THIS PAGE IS SUBJECT TO THE
RESTRICTION ON THE TITLE PAGE OF THIS DOCUMENT.
C OMMAND S YSTEMS D IVISION
3.1 GENERAL
This chapter contains applicable maintenance practices related to the RT-1601 Receiver –
Transmitter. Included in this section are inspection, adjustments and troubleshooting test point
waveforms, cleaning and repair information; and disassembly/assembly instructions.
3.2 VISUAL INSPECTION
A routine visual inspection should be performed any time the receiver transmitter is removed from
the aircraft. The following areas are of prime importance.
A. Chassis
Inspect the chassis for loose or missing hardware, deformation, damaged fasteners, or damaged
connectors.
B. Connectors
Inspect the connector bodies for broken parts; check the insulation for cracks; and check the
contacts for damage, misalignment, corrosion or bad plating. Check for broken, loose, or poorly
soldered connections to the terminals of the connectors. Inspect connector hoods and cable
clamps for pinched wires.
C. Terminal Connections
Inspect for corrosion and loose connections.
D. Wiring
Inspect the wiring of the chassis and subassemblies for any signs of physical damage or
charring.
E. Capacitors
Inspect capacitors for case or body damage and for loose, broken or corroded terminal
connections.
F. Resistors and Diodes
Inspect for blistered, charred, or cracked bodies; also check for loose, broken, or corroded
terminal connections.
The document reference is online, please check the correspondence between the online documentation and the printed version.

Telephonics RT-1601 Specifications

General

Weight	22 lbs
Power Supply	+24 VDC
Channels	Preset
Image Rejection	80 dB
IF Rejection	80 dB

Summary

Chapter 3 Maintenance Practices

3.1 General Overview

This section covers applicable maintenance practices for the RT-1601 Receiver-Transmitter, including inspection, adjustments, and repair.

3.2 Visual Inspection Procedures

Details routine visual inspection for the receiver transmitter, focusing on key areas like chassis, connectors, wiring, and components.

3.3 Cleaning Guidelines

Provides instructions for cleaning the receiver transmitter unit, including precautions for electrical parts and materials.

3.4 Proper Test Equipment Usage

Emphasizes the importance of using correct test equipment to prevent damage to semiconductor devices and integrated circuits.

3.5 Capacitor Checking Precautions

Outlines careful procedures for checking tantalum capacitors, stressing the importance of observing voltage and polarity markings.

3.6 Repair Procedures and Precautions

Details critical safety warnings and essential precautions for performing repairs on the equipment.

3.6.A Repair Precautions

Lists essential precautions for performing repairs, including ESDS device handling, power disconnection, and component replacement.

3.6.B Electrostatic Discharge Sensitive (ESDS) Devices

Explains ESDS devices, risks of electrostatic discharge, and necessary precautions for handling and repair.

3.6.C Printed Circuit Boards

Provides guidance on replacing components on PC boards and re-applying protective sealant to repaired areas.

3.6.D Feed-Thru Capacitors or Filters Replacement

Details the steps for removing and replacing feed-thru capacitors or filters from the chassis.

3.6.E Power Transistors Replacement

Describes the procedure for replacing power transistors, including thermal compound application and verification.

3.6.F PC Board Two-Lead Component Removal

Outlines the process for removing and replacing two-lead components like resistors and capacitors on PC boards.

3.6.G PC Board Multi-Lead Component Removal

Details the procedure for removing and replacing multi-lead components, such as ICs, from printed circuit boards.

3.6.H TR Limiter Replacement

Explains how to replace the TR Limiter assembly and perform post-replacement tests.

3.6.I Mixer Duplexer Replacement

Covers replacement of the Mixer Duplexer assembly or its diodes and subsequent testing procedures.

3.6.J Power Supply Fuse F1001 Replacement

Guides the replacement of the power supply fuse F1001 and notes associated power supply voltage checks.

3.6.K Magnetron Replacement

Details the procedure for replacing the Magnetron assembly and performing required post-replacement tests.

3.6.L Local Oscillator Replacement

Describes the process for replacing the Local Oscillator assembly and performing post-replacement tests.

3.7 Semiconductor Service Information

Provides information relevant to servicing semiconductor components within the equipment.

3.7.A Transistor Testing and Base Connection

Offers guidance on how to test transistors and identify their base connections.

3.8 Integrated Circuit Service Information

Contains information related to the service and testing of integrated circuits used in the equipment.

3.8.A Series 54/74 Integrated Circuits

Details series 54/74 integrated circuits, including type number variations and specification differences.

3.8.C Digital Integrated Circuit Testing

Explains methods for testing digital integrated circuits by analyzing input and output logic levels.