Texas Instruments TPS6104 Series - Page 35

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PACKAGE OUTLINE
C
6X
0.35
0.25
1.6 0.1
6X
0.3
0.2
2X
1.3
1 0.1
4X 0.65
0.8
0.7
0.05
0.00
B
2.1
1.9
A
2.1
1.9
(0.2) TYP
WSON - 0.8 mm max heightDRV0006A
PLASTIC SMALL OUTLINE - NO LEAD
4222173/B 04/2018
PIN 1 INDEX AREA
SEATING PLANE
0.08 C
1
3
4
6
(OPTIONAL)
PIN 1 ID
0.1 C A B
0.05 C
THERMAL PAD
EXPOSED
7
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
SCALE 5.500