4
TPS61040
,
TPS61041
SLVS413I –OCTOBER 2002–REVISED DECEMBER 2016
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Product Folder Links: TPS61040 TPS61041
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(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN MAX UNIT
Supply voltages on pin V
IN
(2)
–0.3 7 V
Voltages on pins EN, FB
(2)
–0.3 V
IN
+ 0.3 V
Switch voltage on pin SW
(2)
30 30 V
Operating junction temperature, T
J
–40 150 °C
Storage temperature, T
stg
–65 150 °C
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 500-V HBM is possible with the necessary precautions. Pins listed as ±XXX V may actually have higher performance.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 250-V CDM is possible with the necessary precautions. Pins listed as ±YYY V may actually have higher performance.
6.2 ESD Ratings
VALUE UNIT
V
(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±2000
V
Charged-device model (CDM), per JEDEC specification JESD22-
C101
(2)
±750
(1) See application section for further information.
6.3 Recommended Operating Conditions
MIN NOM MAX UNIT
V
IN
Input voltage range 1.8 6 V
V
OUT
Output voltage range 28 V
L Inductor
(1)
2.2 10 μH
f Switching frequency
(1)
1 MHz
C
IN
Input capacitor
(1)
4.7 μF
C
OUT
Output capacitor
(1)
1 μF
T
A
Operating ambient temperature –40 85 °C
T
J
Operating junction temperature –40 125 °C
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
6.4 Thermal Information
THERMAL METRIC
(1)
TPS61040 TPS61041
UNITDBV DDC DRV DBV DRV
5 PINS 5 PINS 6 PINS 5 PINS 6 PINS
R
θJA
Junction-to-ambient thermal resistance 205.2 214.7 83.0 205.2 83.0 °C/W
R
θJC(top)
Junction-to-case (top) thermal resistance 118.3 38.5 57.1 118.3 57.1 °C/W
R
θJB
Junction-to-board thermal resistance 34.8 35.4 52.9 34.8 52.9 °C/W
ψ
JT
Junction-to-top characterization parameter 12.2 0.4 2.4 12.2 2.4 °C/W
ψ
JB
Junction-to-board characterization parameter 33.9 34.8 53.4 33.9 53.4 °C/W
R
θJC(bot)
Junction-to-case (bottom) thermal resistance — — 26.9 — 26.9 °C/W
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