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Toshiba 40L2546 - Page 13

Toshiba 40L2546
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z Lead-free solder
This product uses lead-free solder (unleaded) to help protect the environment. Please read these instructions
before attempting any soldering work.
Caution: Always wear safety glasses to prevent fumes or molten solder from getting into
the eyes. Lead-free solder can splatter at high temperatures (600).
Lead-free solder indicator
Printed circuit boards using lead-free solder are engraved with an "F."
Properties of lead-free solder
The melting point of lead-free solder is 40-50 higher than leaded solder.
Servicing solder
Solder with an alloy composition of Sn-3.0Ag-0.5Cu or Sn-0.7Cu is recommended. Although servicing with
leaded solder is possible, there are a few precautions that have to be taken. (Not taking these precautions may
cause the solder to not harden properly, and lead to consequent malfunctions.)
Precautions when using leaded solder
z Remove all lead-free solder from soldered joints when replacing components.
z If leaded solder should be added to existing lead free joints, mix in the leaded solder thoroughly after the
lead-free solder has been completely melted (do not apply the soldering iron without solder).
Servicing soldering iron
A soldering iron with a temperature setting capability (temperature control function) is recommended.
The melting point of lead-free solder is higher than leaded solder. Use a soldering iron that maintains a high
stable temperature (large heat capacity), and that allows temperature adjustment according to the part being
serviced, to avoid poor servicing performance.
Recommended soldering iron:
z Soldering iron with temperature control function (temperature range: 320-450)
Recommended temperature range per part:
Part Soldering iron temperature
Mounting (chips) on mounted PCB 320ºC±30ºC
Mounting (chips) on empty PCB 380ºC±30ºC
Chassis, metallic shield, etc. 420ºC±30ºC
(1) IR PWB, KEY PWB, SIDE I/O PWB, T PWB
(2) FORMATTER PWB
(3) POWER BOARD
The PWB assembly which has used lead free
1

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