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TUYA TYWRD2S - 6.2 Recommended PCB Encapsulation; 6.3 Production Instructions

TUYA TYWRD2S
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TYWRD2S Datasheet
Hangzhou Tuya Information Technology Co., Ltd. 14 V2.0.0
6.2 Recommended PCB Encapsulation
Figure 6-3 TYWRD2S pins
Figure 6-4 PCB encapsulation diagram of TYWRD2S
6.3 Production Instructions
1. Use an SMT placement machine to mount components to the stamp hole module that
Tuya produces within 24 hours after the module is unpacked and the firmware is
burned. If not, vacuum pack the module again. Bake the module before mounting
components to the module.
(1) SMT placement equipment
i. Reflow soldering machine