ULTRA TEC ULTRAPOL Advance

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Summary

Regulatory Agency Certification

I. INTRODUCTION

A. Scope of Use

Defines the intended applications of the lapping machine for various materials.

B. Parts List - Whats included

Lists all components and accessories included with the ULTRAPOL Advance unit.

C. Power Supply

Details the input and output specifications for the machine's power supply.

D. Specifications

Provides technical specifications such as model number, dimensions, and laser properties.

E. Labels and Warnings

F. Suggested Services; supplies

G. Optional Services; supplies

II. INSTALLATION AND OVERVIEW

A. Installing Ultrapol Advance

Details the mechanical, coolant, and electrical installation steps for the ULTRAPOL Advance unit.

i. Mechanical

Describes how to assemble the Mast Head assembly onto the Base Unit securely.

ii. Coolant

Explains how to connect and operate the coolant system for the polishing process.

iii. Drain

Provides instructions for setting up the drainage system for the machine.

iv. Electrical

v. Ultracollimator Installation

B. Operating the Ultrapol Advance Safely

i. Safety Precautions

Outlines essential safety measures to follow when operating the ULTRAPOL Advance, especially concerning laser radiation.

C. Overview of Functions

Baser Unit

Identifies and describes the controls and features on the main base unit of the ULTRAPOL Advance.

Mast;Head Assembly

Ultracollimator System (Optional feature)

D. Operator Controls;Features

i. Adjusting the Amplitude of Oscillation

Explains the procedure for adjusting the sweep amplitude of the oscillation mechanism.

E. Work holders and Accessories

i. Standard Quick Release Plate (6170.1)

Describes the standard quick release plate for holding samples and its features.

ii. SEM Stub Holder

iii. Encapsulated Mount Holder

III. CALIBRATION

A. Mechanical Alignment

Guides through the process of aligning the base plate and work holder using a micrometer.

i. Aligning the base plate to the Aluminum platen.

Step-by-step instructions for aligning the base plate to the platen using a micrometer.

X-plane alignment (3 oclock and 9 oclock positions)

Details the alignment procedure for the X-plane using specific rotation positions.

Y-plane alignment (12 oclock and 6 oclock positions)

ii. Aligning the sample head to the platen.

IV. PREPARATION FOR FLAT POLISHING

A. Mounting a Bare Die Sample

Instructions for preparing and mounting a bare die sample onto the holder for polishing.

B. Aligning Sample for Parallel Polishing with Ultracollimator

C. Load Control

D. Correcting for Observed Tilt During Polishing

V. APPLICATIONS

A. Topside Delayering of Single Die ICs

Describes the standard delayering process using polyurethane laps and colloidal silica slurry.

i. Parallel Delayering Techniques

Describes the standard delayering process using polyurethane laps and colloidal silica slurry.

ii. Tips for Delayering

Provides useful tips for mounting, orientation, and process adjustments during delayering.

B. Backside Preparation

i. Package Level (Flip Chip)

Instructions for mounting package samples, ensuring line-of-sight for the Ultracollimator.

Mounting

Instructions for mounting package samples, ensuring line-of-sight for the Ultracollimator.

ii. Lapping

iii. Die Level

C. Cross-sectioning of Die; Packages

D. Other Lapping & Polishing Applications

VI. PREVENTATIVE MAINTENANCE

A. Clean Up

Outlines daily procedures for cleaning the machine to ensure proper function.

B. Flushing the recirculation pump

Details the process for flushing the recirculation pump to prevent contamination and extend its life.

C. Reconditioning the Polyurethane Lap

VII. ACCESSORIES, CONSUMABLES & SPARES

APPENDICES

Appendix A: Timer Manual

Appendix B: CE Certification

Appendix C: Wiring Diagram