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Winbond ISD1700 Series - User Manual

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PRELIMINARY
Publication Release Date: February 7, 2006
Revision 1.2
ISD1700
Series
Multi-Message
Single-Chip
Voice Record & Playback Devices

Table of Contents

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Summary

1 GENERAL DESCRIPTION

2 FEATURES

Message Management and Operation Modes

Covers integrated message systems, push-button, and dual operating modes.

Input;Output and Standard Capabilities

Details input/output channels, standard features, and indicators.

Configuration and Options

Lists sampling frequency, duration, temperature, and package options.

3 BLOCK DIAGRAM

4 PINOUT CONFIGURATION

5 PIN DESCRIPTION

6 FUNCTIONAL DESCRIPTION

6.1 DETAILED DESCRIPTION

Provides an in-depth explanation of the device's functionality.

6.1.1 Audio Quality

Explains the use of ChipCorder MLS technology for natural voice reproduction.

6.1.2 Message Duration

Details how sampling rate and duration are set by an external resistor.

6.1.3 Flash Storage

Describes non-volatile storage using Flash memory with retention and rewrite cycles.

6.2 MEMORY ARRAY ARCHITECTURE

Details the memory array for voice data and Sound Effects (SEs).

6.3 MODES OF OPERATIONS

Explains the device's operational modes.

6.3.1 Standalone (Push-Button) Mode

Explains standalone mode using REC, PLAY, FT, etc. pins for operation.

6.3.2 SPI Mode

Describes operation via a 4-wire serial interface with microcontroller control.

7 ANALOG PATH CONFIGURATION (APC)

7.1 APC REGISTER

Details the bits and functions of the APC register.

7.2 DEVICE ANALOG PATH CONFIGURATIONS

Demonstrates analog path configurations based on APC register and operation states.

8 STANDALONE (PUSH-BUTTON) OPERATIONS

8.1 OPERATION OVERVIEW

Provides an overview of standalone operation, pointers, and indicators.

8.1.1 Record Operation

Details how to initiate and perform a record operation using the REC pin.

8.1.2 Playback Operation

Explains the two playback modes: edge-trigger and sequential.

8.1.3 Forward Operation

Describes moving the playback pointer to the next message using the FWD pin.

8.1.4 Erase Operation

Details individual and global erase operations based on playback pointer position.

8.1.5 Reset Operation

Explains how the RESET pin initializes device pointers and state.

8.1.6 VOL Operation

Describes volume adjustment steps using the VOL pin.

8.1.7 FT (Feed-Through) Operation

Details the FT pin's control over the feed-through path.

8.2 vALERT FEATURE (OPTIONAL)

Explains the optional vAlert feature for new message indication.

8.3 SOUND EFFECT (SE) EDITING

Covers accessing and editing Sound Effects (SEs) via push buttons.

8.3.1 Sound Effects (SEs)

Lists the functions of the four Sound Effects (SE1-SE4).

8.3.2 Entering SE Mode

Describes the procedure to enter SE editing mode.

8.3.3 SE Editing

Explains how to perform record, play, or erase operations on individual SEs.

8.3.4 Exiting SE Mode

Details the procedure for exiting SE editing mode.

8.3.5 Sound Effect Duration

Lists sound effect durations based on sampling frequency.

8.4 ANALOG INPUTS

Describes the device's analog input options.

8.4.1 Microphone Input

Explains the MIC input impedance and circuit.

8.4.2 Analn Input

Explains the Analn input impedance and circuit.

9 CIRCULAR MEMORY MANAGEMENT

9.1 RESTORING CIRCULAR MEMORY ARCHITECTURE

Describes how to restore circular memory architecture if it is broken.

10 SERIAL PERIPHERAL INTERFACE (SPI) MODE

10.1 MICROCONTROLLER INTERFACE

Details the 4-wire SPI interface for microcontroller control.

10.2 SPI INTERFACE OVERVIEW

Explains the SPI protocol and data transfer.

10.2.1 SPI Transaction Format

Describes the format of an SPI transaction.

10.2.2 MOSI Data Format

Details the data format for the MOSI line.

10.2.3 MISO Data Format

Details the data format for the MISO line.

10.3 SPI COMMAND OVERVIEW

Provides an overview of different SPI command categories.

10.4 SWITCHING FROM SPI MODE TO STANDALONE MODE

Lists precautions for switching from SPI to standalone mode.

10.5 ISD1700 DEVICE REGISTERS

Introduces the internal registers of the ISD1700 device.

10.5.1 Status Register 0 (SR0)

Describes Status Register 0 bits and their meanings.

10.5.2 Status Register 1 (SR1)

Describes Status Register 1 bits and their meanings.

10.5.3 APC Register

Details the Analog Path Configuration (APC) register.

10.5.4 Play Pointer

Describes the Play Pointer register.

10.5.5 Record Pointer

Describes the Record Pointer register.

10.5.6 DEVICEID Register

Describes the DEVICEID register for device identification.

11 SPI COMMAND REFERENCE

11.1 SPI PRIORITY COMMANDS

Lists commands that are always accepted and control basic functions.

11.1.1 PU Power Up (0 x01)

Details the PU command for powering up the device.

11.1.2 STOP (0 x02)

Details the STOP command to halt current operations.

11.1.3 RESET (0 x03)

Details the RESET command to reset the device.

11.1.4 CLR_INT(0 x04)

Details the CLR_INT command to clear interrupts.

11.1.5 RD_STATUS (0 x05)

Details the RD_STATUS command to read device status.

11.1.6 PD (0 x07) Power Down

Details the PD command for powering down the device.

11.1.7 DEVID (0 x09) Read Device ID

Details the DEVID command to read the device ID.

11.2 CIRCULAR MEMORY COMMANDS

Commands for managing circular memory operations.

11.2.1 PLAY (0 x40)

Details the PLAY command for playback from current pointer.

11.2.2 REC (0 x41)

Details the REC command for recording from current pointer.

11.2.3 ERASE (0 x42)

Details the ERASE command for message deletion.

11.2.4 G_ERASE (0 x43) Global Erase

Details the G_ERASE command for erasing all messages.

11.2.5 FWD (0 x48)

Details the FWD command to advance to the next message.

11.2.6 CHK_MEM (0 x49) Check Circular Memory

Details the CHK_MEM command to verify memory validity.

11.2.7 RD_PLAY_PTR (0 x06)

Details the RD_PLAY_PTR command to read the play pointer.

11.2.8 RD_REC_PTR (0 x08)

Details the RD_REC_PTR command to read the record pointer.

11.3 ANALOG CONFIGURATION COMMANDS

Commands for configuring analog path settings.

11.3.1 RD_APC (0 x44) Read APC Register

Details the RD_APC command to read the APC register.

11.3.2 WR_APC1 (0 x45) Load APC Register

Details the WR_APC1 command to load APC register with volume setting.

11.3.3 WR_APC2 (0 x65) Load APC Register

Details the WR_APC2 command to load APC register with volume setting.

11.3.4 WR_NVCFG (0 x46) Write APC to Non-Volatile Memory

Details the WR_NVCFG command to save APC to non-volatile memory.

11.3.5 LD_NVCFG (0 x47) Load APC register from Non-Volatile Memory

Details the LD_NVCFG command to load APC from non-volatile memory.

11.4 DIRECT MEMORY ACCESS COMMANDS

Commands for direct memory access with start/end addresses.

11.4.1 SET PLAY (0 x80)

Details SET_PLAY for playback with specified addresses.

11.4.2 SET_REC (0 x81)

Details SET_REC for recording with specified addresses.

11.4.3 SET_ERASE (0 x82)

Details SET_ERASE for erasing with specified addresses.

11.5 ADDITIONAL COMMAND

Covers additional commands for enhanced functionality.

EXTCLK

Details the EXTCLK command for external clock mode.

12 TIMING DIAGRAMS

12.1 RECORD, PLAY AND ERASE

Shows timing diagrams for record, play, and erase operations.

13 ABSOLUTE MAXIMUM RATINGS

14 ELECTRICAL CHARACTERISTICS

14.1 DC PARAMETERS

Lists DC electrical parameters with their minimum, typical, and maximum values.

14.2 AC PARAMETERS

Lists AC electrical parameters with their timing specifications.

15 TYPICAL APPLICATION CIRCUITS

15.1 GOOD AUDIO DESIGN PRACTICES

Provides recommendations for good audio design practices in layout and decoupling.

16 DIE PHYSICAL LAYOUT

16.1 ISD1700 Series

Illustrates the physical layout of the ISD1700 die.

17 PACKAGING

17.2 28-LEAD 300-MIL PLASTIC SMALL OUTLINE INTEGRATED CIRCUIT (SOIC)

Shows dimensions for the 300-mil SOIC package.

17.3 28-LEAD 600-MIL PLASTIC DUAL INLINE PACKAGE (PDIP)

Shows dimensions for the 600-mil PDIP package.

16.4 DIE INFORMATION

18 ORDERING INFORMATION

19 VERSION HISTORY

Winbond ISD1700 Series Specifications

General IconGeneral
SeriesISD1700
ManufacturerWinbond
Memory TypeFlash
Recording DurationUp to 16 min
Sampling Frequency4 kHz to 12 kHz
Operating Voltage2.4V - 5.5V
Standby Current1 μA typical
InterfaceSPI
Package TypeDIP, SOIC
FunctionsRecord, Playback
Message ManagementMultiple message storage and retrieval
CoreNot applicable
Program Memory SizeNot applicable
RAM SizeNot applicable
CategoryVoice Record/Playback