SERVICE MANUAL
HAMAMATSU, JAPAN
1.27K-389 Printed in Japan ’02, 06
CL 001675
■ CONTENTS
SPECIFICATIONS .............................................................................. 3
PANEL LAYOUT.................................................................................. 4
CIRCUIT BOARD LAYOUT................................................................. 5
BLOCK DIAGRAM .............................................................................. 6
DISASSEMBLY PROCEDURE ........................................................... 7
LSI PIN DESCRIPTION .................................................................... 14
IC BLOCK DIAGRAM........................................................................ 16
CIRCUIT BOARDS ........................................................................... 17
INSPECTION .................................................................................... 24
MIDI IMPLEMENTATION CHART..................................................... 26
OVERALL CIRCUIT DIAGRAM
PARTS LIST
This document is printed on chlorine free (ECF) paper with soy ink.
CLP-110
CLP-110
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