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CLM920_AC3 Module Hardware Usage Guide
Shanghai Yuge Information Technology co., LTD
- 4 -
3.12 WLAN interface (under developing)........................................................................ - 35 -
3.13 ADC interface........................................................................................................... - 36 -
3.14 RF interface...............................................................................................................- 37 -
3.14.1 Antenna matching circuit....................................................................................- 37 -
3.14.2 RF trace reference...............................................................................................- 39 -
Chapter 4. Overall Technical Indicators............................................................................... - 41 -
4.1 Chapter overview........................................................................................................ - 41 -
4.2 Working frequency......................................................................................................- 41 -
4.3 Conducted radio frequency measurement...................................................................- 41 -
4.3.1 Test environment.................................................................................................. - 41 -
4.3.2 Standard test......................................................................................................... - 42 -
4.4 Conducted receiving sensitivity and transmit power.................................................. - 42 -
4.5 Antenna requirements................................................................................................. - 43 -
4.6 Power consumption characteristics.............................................................................- 44 -
Chapter 5. Interface Electrical Characteristics..................................................................... - 46 -
5.1 Chapter overview........................................................................................................ - 46 -
5.2 Working storage temperature...................................................................................... - 46 -
5.3 Module IO level.......................................................................................................... - 46 -
5.4 Voltage........................................................................................................................ - 46 -
5.5 Electrostatic property.................................................................................................. - 47 -
5.6 Reliability index..........................................................................................................- 47 -
Chapter 6.Structural and mechanical properties...................................................................- 50 -
6.1 Chapter overview........................................................................................................ - 50 -
6.2 Exterior....................................................................................................................... - 50 -
6.3 Mechanical Dimensions..............................................................................................- 50 -
Chapter 7. Packaging and Production.................................................................................. - 53 -
7.1 Chapter overview........................................................................................................ - 53 -
7.2 Module packaging and storage................................................................................... - 53 -
7.3 Production welding..................................................................................................... - 53 -
Chapter 8. Appendix.............................................................................................................- 55 -
8.1 Chapter overview........................................................................................................ - 55 -

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