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YUGE CLM920 AC5 - User Manual

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Product name
CLM920_AC5 Mini PCIE LTE Module
Hardware Manual
Number of pages
37
Version
V1.2
Date
2020/5/11
CLM920_AC5 Mini PCIE
LTE Module Hardware Manual
V1.2
Shanghai YUGE Information Technology Co., Ltd.

Table of Contents

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Overview

  1. Technical Specifications
  2. Usage Features
  3. Maintenance Features

The CLM920_AC5 Mini PCIE LTE Module is a wireless terminal product designed to integrate FDD-LTE, TDD-LTE, WCDMA, and other network standards. It supports the three major network formats of China Mobile Unicom Telecom and embeds supported operating systems such as Windows series, Linux, and Android. The module is suitable for various applications including car equipment, wireless POS machines, wireless advertising media, remote monitoring, smart meter reading, mobile broadband, and automated industry, as well as other wireless terminals.

Technical Specifications:

  • Physical Characteristics: The module measures 51mm x 30mm x 3.6mm.
  • Fixed Way: It features a ground screw hole (2) for secure mounting.
  • Application Processor: It uses a single-core ARM Cortex-A7 processor, clocked at 1.2GHz, with a 256KB level 2 cache.
  • Operating Voltage: The typical operating voltage is 3.7V, with a range of 3.3V to 4.2V.
  • Energy Saving Current: The standby current is less than 5mA.
  • Application Interface:
    • Standard SIM interface, supporting 3.0V/1.8V, with hot swap functionality.
    • USB2.0 (High-Speed) interface.
    • Hardware reset interface.
    • UART serial interface.
    • PCM voice interface.
    • Power interface.
    • Network status indication interface.
  • Antenna Connector: It includes a main set antenna connector (MM4829-2702RA4) and a diversity antenna connector (MM4829-2702RA4).
  • Transmit Power:
    • LTE: Class 3 (23dBm ± 2dB).
    • UMTS: Class 3 (24dBm+1/-3dB).
  • Data Service: WCDMA.
    • UMTS R99: DL 384 kbps/UL 384 kbps.
    • DC-HSPA+: DL 42 Mbps/UL 5.76 Mbps.
    • LTE:
      • LTE FDD: DL 150Mbps/UL 50Mbps@20M BW cat4.
      • LTE TDD: DL 130Mbps/UL 35Mbps@20M BW cat4.
      • LTE FDD: DL 10Mbps/UL 5Mbps@20M BW cat1.
      • LTE TDD: DL 10Mbps/UL 5Mbps@20M BW cat1.
  • Diversity Antenna: Supports LTE diversity antenna.
  • AT Command: Supports standard AT instruction sets (Hayes 3GPP TS 27.007 and 27.005).
  • SMS Business: Supports point-to-point MO and MT. SMS storage: USIM card / ME (default).
  • Virtual Network Card: Supports USB virtual network card.
  • Temperature Range:
    • Normal operating temperature: -35°C to +75°C.
    • Extreme operating temperature: -40°C to +85°C.
    • Storage temperature: -40°C to +85°C.
  • Module Function Distinction: The label indicates M for the main set, D for the table diversity, F for the FDD band, and T for the TDD band.
  • RF Frequency Table:
    • LTE B1: Upstream 1920MHz-1980MHz, Downlink 2110MHz-2170MHz (FDD).
    • LTE B3: Upstream 1710MHz-1785MHz, Downlink 1805MHz-1880MHz (FDD).
    • LTE B5: Upstream 824MHz-849MHz, Downlink 869MHz-894MHz (FDD).
    • LTE B8: Upstream 880MHz-915MHz, Downlink 925MHz-960MHz (FDD).
    • LTE B38: Upstream 2570MHz-2620MHz, Downlink 2570MHz-2620MHz (TDD).
    • LTE B39: Upstream 1880MHz-1920MHz, Downlink 1880MHz-1920MHz (TDD).
    • LTE B40: Upstream 2300MHz-2400MHz, Downlink 2300MHz-2400MHz (TDD).
    • LTE B41: Upstream 2496MHz-2690MHz, Downlink 2496MHz-2690MHz (TDD).
    • UMTS B1: Upstream 1920MHz-1980MHz, Downlink 2110MHz-2170MHz (WCDMA).
    • UMTS B5: Upstream 824MHz-849MHz, Downlink 869MHz-894MHz (WCDMA).
    • UMTS B8: Upstream 880MHz-915MHz, Downlink 925MHz-960MHz (WCDMA).
  • Conducted RF Measurement (3G):
    • WCDMA B1: Up 1920MHz-1980MHz, Down 2110MHz-2170MHz. Power 23+2/-2dBm, Receive sensitivity <-109dBm.
    • WCDMA B5: Up 824MHz-849MHz, Down 869MHz-894MHz. Power 23+2/-2dBm, Receive sensitivity <-109dBm.
    • WCDMA B8: Up 880MHz-915MHz, Down 925MHz-960MHz. Power 23+2/-2dBm, Receive sensitivity <-109dBm.
  • Conducted RF Measurement (4G Sensitivity Index):
    • LTE B1 (FDD QPSK): < -96.3 (10 MHz), Typical -98, Max -99.
    • LTE B3 (FDD QPSK): < -93.3 (10 MHz), Typical -95, Max -96.
    • LTE B5 (FDD QPSK): < -94.3 (10 MHz), Typical -96, Max -97.
    • LTE B8 (TDD QPSK): < -93.3 (10 MHz), Typical -96, Max -97.
    • LTE B38 (TDD QPSK): < -96.3 (10 MHz), Typical -97, Max -98.
    • LTE B39 (TDD QPSK): < -96.3 (10 MHz), Typical -98, Max -99.
    • LTE B40 (TDD QPSK): < -96.3 (10 MHz), Typical -98, Max -99.
    • LTE B41 (TDD QPSK): < -96.3 (10 MHz), Typical -97, Max -98.
  • 4G RF Transmit Power Index (dBm):
    • LTE B1, B3, B5, B8, B38, B39, B40, B41: Min 21-25, Typical 23, Max 24.
  • Main Antenna Specifications:
    • Standing Wave Ratio: <2.5:1 for all bands.
    • Antenna Gain: > -4dbi for all bands.
    • Effectiveness: > 40% for all bands.
    • TRP: 19 for all bands.
    • TIS: <-94 for B1, B8 FDD; <-91 for B3 FDD; <-92 for B5 FDD; <-93 for B38, B39, B40, B41 TDD; <-106 for WCDMA B1, B5, B8.
  • Power Consumption Characteristics (WCDMA):
    • WCDMA B1: Power 24 dBm, Current 490 mA.
    • WCDMA B5: Power 24 dBm, Current 512 mA.
    • WCDMA B8: Power 24 dBm, Current 467 mA.
  • Power Consumption Characteristics (LTE):
    • LTE-FDD B1 @10Mbps: Channel 18050/21.6 dBm (624 mA), 18300/21.7 dBm (626 mA), 18550/21.5 dBm (612 mA).
    • LTE-FDD B3 @10Mbps: Channel 19250/21.6 dBm (635 mA), 19575/22 dBm (576 mA), 19900/22 dBm (598 mA).
    • LTE-FDD B5 @10Mbps: Channel 20450/22.5 dBm (530 mA), 20525/22.5 dBm (518 mA), 20600/22.5 dBm (520 mA).
    • LTE-FDD B8 @10Mbps: Channel 21500/22.3 dBm (577 mA), 21625/21.8 dBm (575 mA), 21750/22 dBm (577 mA).
    • LTE-TDD B38 @10Mbps: Channel 37800/22.4 dBm (475 mA), 38000/22 dBm (430 mA), 38200/21.8 dBm (446 mA).
    • LTE-TDD B39 @10Mbps: Channel 38300/22 dBm (352 mA), 38450/22 dBm (350 mA), 38600/22 dBm (351 mA).
    • LTE-TDD B40 @10Mbps: Channel 38700/22 dBm (425 mA), 39150/21.8 dBm (414 mA), 39600/22.2 dBm (424 mA).
    • LTE-TDD B41 @10Mbps: Channel 39700/22.5 dBm (548 mA), 40620/22.1 dBm (436 mA), 41540/21.9 dBm (445 mA).
  • Electrical Characteristics (IO Level):
    • General IO port level is 1.8V (except SIM, which supports 1.8V and 3.0V).
    • VIH (High level input voltage): Min 0.65*VDD_EXT, Max VDD_EXT+0.3V.
    • VIL (Low level input voltage): Max 0.35*VDD_EXT.
    • VOH (High level output voltage): Min VDD_EXT-0.45V, Max VDD_EXT.
    • VOL (Low level output voltage): Min 0, Max 0.45V.
  • Working Voltage:
    • VBAT: Min 3.3V, Typical 3.7V, Max 4.2V.
    • UIM_PWR: Min 1.7V/2.75V, Typical 1.8V/2.85V, Max 1.9V/2.95V.
  • ESD Features:
    • USB interface: Contact discharge ±4 KV, Air discharge ±8 KV.
    • USIM interface: Contact discharge ±4 KV, Air discharge ±8 KV.
    • Analog voice interface: Contact discharge ±4 KV, Air discharge ±8 KV.
    • VBAT power supply: Contact discharge ±4 KV, Air discharge ±8 KV.

Usage Features:

  • 52-pin Gold Finger: The module uses a 52-pin Mini PCIE gold finger as its external interactive interface, conforming to the PCI Express Mini Card 1.2 standard.
  • Power Interface:
    • The module operates in a single power supply mode, with 5 power supply pins and 14 ground pins. All power and ground pins must be connected.
    • Recommended power supply is 3.7V / 2A.
    • A 220uF capacitor near the power input is recommended to handle current peaks during data transmission or conversation.
    • Customers can use DCDC or LDO for current supply and control VBAT power through a MOS tube for complete power off.
  • Power On/Off Reset Mode:
    • Boot Sequence: The module has a defined power-on sequence with specific timing parameters for start-up low-level width (Ton: 100-500mS), boot time based on status (Ton(status): 22S), USB status (Ton(usb): 20S), and UART status (Ton(uart): 20S). PWRKEY input high level (VIH) is 0.6-1.8V, and low level (VIL) is -0.3-0.5V.
    • Power Off: The module can be powered off by cutting off the VBAT power supply. For abnormal situations where the module cannot be restarted, a power-off restart is recommended, with an interval of more than 30s between restarts.
    • Reset Control: Pin 22 (RESET) can be pulled low for 150-450ms to reset the module. It is sensitive to interference, so routing should avoid RF interference signals.
  • USB Interface:
    • Supports USB2.0 high-speed protocol (480Mbps) and full-speed (12Mbps) modes.
    • Requires strict adherence to USB2.0 protocol for wiring, with differential wiring and a control impedance of 90 Ω.
    • ESD protection devices (less than 2pF capacitance) are recommended on data lines.
    • The USB interface bus power is provided internally by the module; no external supply is needed. The module acts as a slave device.
    • Supports USB sleep and wake-up mechanisms.
    • Functions include software download and upgrade, data communication, AT Command, and GNSS NMEA output.
  • UART Interface:
    • Provides a set of UART interfaces with a serial port level of 1.8V.
    • Supports AT commands, print program log information.
    • Baud rates supported: 9600, 19200, 38400, 57600, 115200, 230400bps (default 115200bps).
    • For serial port connection, an external level conversion chip may be needed to achieve level matching if the serial port level is not 1.8V.
  • USIM Interface:
    • Compatible with ISO 7816-3 standard.
    • Power for the USIM card is provided by the internal power regulator, supporting 1.8V / 3.0V.
    • USIM Card Hot Swap Detection: UIM_DET pin (Pin 6) is used for hot swap detection. High value indicates SIM card insertion, low value indicates SIM card removal.
  • General GPIO Interface:
    • AP_READY (Pin 19): Reserved.
    • W_DISABLE# (Pin 20): Active low, turns off RF communication.
    • WAKEUP_IN (Pin 32): 1.8V active low, module sleep control. This pin is for the host to wake up the module. When pulled up to 1.8V, the host can wake up the module and pull it down to enter sleep mode.
  • Network Indication Interface:
    • LED_WWAN# (Pin 42): Status indicator.
    • Status Indications:
      • No service: Constantly bright.
      • Module registration on non-4G network: Slow flash.
      • Module registers 4G network or module to register non-4G network for voice SMS and other services: Fast flashing.
    • The brightness of the LED lamp can be adjusted by adjusting the current limiting resistance value, with a maximum current of 40mA.
  • RF Antenna Interface:
    • Designed with two antenna interfaces: one main antenna and one diversity antenna. 4G recommends connecting a diversity antenna to limit the signal drop caused by high-speed movement and multipath.
    • RF connector location and dimensions are provided.
  • PCM Digital Voice Interface:
    • Provides a set of PCM audio interfaces.
    • Supports 8-bit A rate, U rate, and 16-bit linear short frame encoding format.
    • PCM_SYNC is 8kHz, PCM_CLK is 2048kHz.
    • PCM Pin Definition:
      • PCM_CLK (Pin 45): DO, PCM clock pulse.
      • PCM_DOUT (Pin 47): DO, PCM data output.
      • PCM_DIN (Pin 49): DI, PCM data input.
      • PCM_SYNC (Pin 51): DO, PCM frame synchronization signal.
    • PCM Specific Parameters: Encoding format Linear, Data bit 16bits, Master/slave mode, PCM clock 2048kHz, PCM frame synchronization Short frame, Data Format MSB.

Maintenance Features:

  • ESD Protection: The module requires ESD protection to ensure product quality.
    • For the USIM interface, it is recommended to select ONSEMFS SMF15C devices for ESD protection. Peripheral circuit devices should be placed close to the card holder.
    • The SIM card holder should be close to the module layout.
    • The USIM card circuit is susceptible to radio frequency interference. The card slot should be placed far away from possible RF radiation, and the card wiring should be as far away as possible from the radio frequency, power supply, and high-speed signal line.
    • UIM_DATA has been internally pulled up to VDD_EXT through a 47K resistor, so no external pull-up is required.
    • UIM_DET is a detection pin inserted or not inserted into the USIM card. It is high level when inserted and low level when not inserted. This pin can be used to detect SIM card status during hot-swap applications.
    • To avoid instantaneous voltage overload, the USIM interface needs a 22R resistor in series on the signal line path.
  • Antenna Matching Circuit: The module provides two RF antenna interfaces. The 50-ohm characteristic impedance trace must be connected to the antenna. The antenna factory can be used to optimize and match the device parameter values according to the user's circuit board wiring. The main board R1 / R3 defaults to 100PF, C1 / C2 / C3 / C4 defaults to empty stickers. To prevent damage to the internal of the module, it is recommended to choose a two-way TVS tube at the antenna connection D1 / D2.
  • Power Supply Protection: To prevent damage to the module caused by surge and overvoltage, it is recommended to connect a 5.1V / 500mW Zener diode in parallel to the VBAT pin.
  • Power-on Time: The power-on time of any interface of the module should not be earlier than the power-on time of the module, otherwise it may cause abnormal operation or damage.
  • Reserved Pins: Pins marked "RESERVED" and "NC" are left floating and must not be used.

YUGE CLM920 AC5 Specifications

General IconGeneral
BrandYUGE
ModelCLM920 AC5
CategoryComputer Hardware
LanguageEnglish