62
065G040210412K---M MLCC 0402 0.1uF -10% 16V X7R MURATA
2nd
SOURCE
065G040210412K---A MLCC 0402 0.1uF -10% 16V X7R SAMSUNG
2nd
SOURCE
C112,C113 065G040222031J---A MLCC 0402 22pF +-5% 50V NPO SAMSUNG
065G040222031J---3
NO-SUGGEST MLCC 0402 22pF -5% 50V NPO
TDK
2nd
SOURCE
065G040222031J---F MLCC 0402 22pF -5% 50V NPO FENGHUA
2nd
SOURCE
C109,C119,C410,C71
5
065G040222415K---F MLCC 0402 0.22uF +-10% 16V X5R FENGHUA
065G040222415K---3
NO-SUGGEST MLCC 0402 0.22uF -10% 16V
X5R TDK
2nd
SOURCE
065G040222415K---A MLCC 0402 0.22uF -10% 16V X5R SAMSUNG
2nd
SOURCE
C102,C103,C105,C10
7,C108,C111
065G040247312K---F MLCC 0402 47nF +-10% 16V X7R FENGHUA
065G040247312K---3
NO-SUGGEST 0402 47nF -10% 16V X7R
TDK
2nd
SOURCE
065G040247312K---A MLCC 0402 47nF -10% 16V X7R SAMSUNG
2nd
SOURCE
C101,C106,C110 065G040250931C---A MLCC 0402 5pF +-0.25pF 50V NPO SAMSUNG
065G040250931C---3
NO-SUGGEST MLCC 0402 5pF -0.25pF 50V
NPO TDK
2nd
SOURCE
C412,C413 065G040256031J---Y MLCC 0402 56pF +-5% 50V NPO YAGEO
065G040256031J---3 MLCC 0402 56pF -5% 50V NPO TDK
2nd
SOURCE
C406 065G0603475A5K---3
NO-SUGGEST MLCC 0603 4.7uF +-10% 10V
X5R TDK
065G0603475A5K---T
MLCC 0603 4.7uF -10% 10V X5R TAIYO
YUDEN
2nd
SOURCE
C401,C404,C409 065G0805106A5K---A MLCC 0805 10uF +-10% 10V X5R SAMSUNG
065G0805106A5K---3
NO-SUGGEST MLCC 0805 10uF -10% 10V
X5R TDK
2nd
SOURCE
U402 070GHDCP500HDC HDCP CODE
FB401,FB402,FB406 071G-56K121--M CHIP BEAD
071G-56K121 CHIP BEAD
2nd
SOURCE
071G-56K121-TA CHIP BEAD 120R/6000mA HCB2012KF-121T60
2nd
SOURCE
FB101,FB102,FB190 071G-59G301--M CHIP BEAD 0603 300R 25% 200mA