ASROCK B560M-HDV R2.0 - Product Specifications

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1.2 Specications
Platform
•
Micro ATX Form Factor
•
Solid Capacitor design
CPU
•
Supports 10
th
Gen Intel® Core
TM
Processors and 11
th
Gen
Intel® Core
TM
Processors (LGA1200)
•
Digi Power design
•
6 Power Phase design
•
Supports Intel® Turbo Boost Max 3.0 Technology
Chipset
•
Intel® B560
Memory
•
Dual Channel DDR4 Memory Technology
•
2 x DDR4 DIMM Slots
•
11
th
Gen Intel® Core
TM
Processors support DDR4 non-ECC,
un-buered memory up to 5000+(OC)*
•
10
th
Gen Intel® Core
TM
Processors support DDR4 non-ECC,
un-buered memory up to 4600+(OC)*
* 11
th
Gen Intel® Core
TM
(i9/i7/i5) support DDR4 up to 2933;
Core
TM
(i3), Pentium® and Celeron® support DDR4 up to 2666.
* 10
th
Gen Intel® Core
TM
(i9/i7) support DDR4 up to 2933;
Core
TM
(i5/i3), Pentium® and Celeron® support DDR4 up to 2666.
* Please refer to Memory Support List on ASRock's website for
more information. (http://www.asrock.com/)
•
Supports ECC UDIMM memory modules (operate in non-
ECC mode)
•
Max. capacity of system memory: 64GB
•
Supports Intel® Extreme Memory Prole (XMP) 2.0
Expansion
Slot
11
th
Gen Intel® Core
TM
Processors
•
1 x PCI Express 4.0 x16 Slot*
10
th
Gen Intel® Core
TM
Processors
•
1 x PCI Express 3.0 x16 Slot*
* Supports NVMe SSD as boot disks
•
2 x PCI Express 3.0 x1 Slots