ASROCK H370 Pro4 - Product Specifications

2
English
1.2 Specications
Platform
•
ATX Form Factor
•
Solid Capacitor design
CPU
•
Supports 8
th
Generation Intel® Core
TM
Processors (Socket
1151)
•
Digi Power design
•
10 Power Phase design
•
Supports Intel® Turbo Boost 2.0 Technology
Chipset
•
Intel® H370
Memory
•
Dual Channel DDR4 Memory Technology
•
4 x DDR4 DIMM Slots
•
Supports DDR4 2666/2400/2133 non-ECC, un-buered
memory
•
Supports ECC UDIMM memory modules (operate in non-
ECC mode)
•
Max. capacity of system memory: 64GB
•
Supports Intel® Extreme Memory Prole (XMP) 2.0
•
15μ Gold Contact in DIMM Slots
Expansion
Slot
•
2 x PCI Express 3.0 x16 Slots (PCIE2/PCIE4: single at x16
(PCIE2); dual at x16 (PCIE2) / x4 (PCIE4))
* If PCIE3 or PCIE5 is occupied, PCIE4 will downgrade to x2
mode.
* Supports NVMe SSD as boot disks
•
3 x PCI Express 3.0 x1 Slots (Flexible PCIe)
•
Supports AMD Quad CrossFireX
TM
and CrossFireX
TM
•
1 x M.2 Socket (Key E), supports type 2230 WiFi/BT module
and Intel® CNVi (Integrated WiFi/BT)
Graphics
* Intel® UHD Graphics Built-in Visuals and the VGA outputs
can be supported only with processors which are GPU
integrated.
•
Supports Intel® UHD Graphics Built-in Visuals : Intel® Quick
Sync Video with AVC, MVC (S3D) and MPEG-2 Full