ASROCK H670 PG Riptide - 1.2 Specifications

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1.2 Specications
Platform
•
ATX Form Factor
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Solid Capacitor design
CPU
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Supports 12
th
Gen Intel® Core
TM
Processors (LGA1700)
•
9 Power Phase design
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Supports Intel® Hybrid Technology
•
Supports Intel® Turbo Boost Max 3.0 Technology
Chipset
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Intel® H670
Memory
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Dual Channel DDR4 Memory Technology
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4 x DDR4 DIMM Slots
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Supports DDR4 non-ECC, un-buered memory up to
5000+(OC)*
* Supports DDR4 3200 natively.
* Please refer to Memory Support List on ASRock's website for
more information. (http://www.asrock.com/)
•
Supports ECC UDIMM memory modules (operate in non-
ECC mode)
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Max. capacity of system memory: 128GB
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Supports Intel® Extreme Memory Prole (XMP) 2.0
Expansion
Slot
•
2 x PCIe x16 Slots (PCIE1/PCIE3: single at Gen5x16 (PCIE1);
dual at Gen5x16 (PCIE1) / Gen4x4 (PCIE3))*
* Supports NVMe SSD as boot disks
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3 x PCIe Gen3x1 Slots
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Supports AMD CrossFire
TM
•
1 x M.2 Socket (Key E), supports type 2230 WiFi/BT PCIe
WiFi module and Intel® CNVi (Integrated WiFi/BT)
Graphics
•
Intel® UHD Graphics Built-in Visuals and the VGA outputs
can be supported only with processors which are GPU
integrated.
•
Intel® X
e
Graphics Architecture (Gen 12)