1.2 Specications
Platform
•
EATX Form Factor
•
8 Layer PCB
•
4 x 2oz Copper PCB
•
High Density Glass Fabric PCB
CPU
•
Supports Intel® Core
TM
i7 and Xeon® E5-1600/2600 v3
Processor Family for the LGA 2011-3 Socket, up to 18 Cores
and 160W
•
Digi Power design
•
12 Power Phase design
•
Supports Intel® Turbo Boost 2.0 Technology
•
Supports Untied Overclocking Technology
Chipset
•
Intel® X99
Memory
•
Quad Channel DDR4 Memory Technology
•
8 x DDR4 DIMM Slots
•
Supports DDR4 3200+(OC)*/2933(OC)/2800(OC)/2400
(OC)/2133/1866/ 1600/1333/1066 non-ECC, un-buered
memory
* Please refer to Memory Support List on ASRock's website for
more information. (http://www.asrock.com/)
•
Supports non-ECC RDIMM (Registered DIMM)
•
Supports DDR4 ECC, un-buered memory/RDIMM with
Intel® Xeon® processors E5 series in the LGA 2011-3 Socket
•
Max. capacity of system memory: 128GB (see CAUTION)
•
Supports Intel® Extreme Memory Prole (XMP) 2.0
•
15 Gold Contact in DIMM Slots
Expansion
Slot
•
7 x PCI Express 3.0 x16 Slots (PCIE1/PCIE2/PCIE3/PCIE4/
PCIE5/PCIE6/PCIE7: single at x16 (PCIE7); dual at x16
(PCIE7) / x16 (PCIE3); triple at x16 (PCIE7) / x16 (PCIE5) /
x16 (PCIE3); quad at x16 (PCIE7) / x16 (PCIE5) / x16 (PCIE3)
/ x16 (PCIE1))
•
2 x embedded PLX PEX 8747
•
Supports AMD Quad CrossFireX
TM
, 4-Way CrossFireX
TM
,
3-Way CrossFireX
TM
and CrossFireX
TM
•
Supports NVIDIA® Quad SLI
TM
, 4-Way SLI
TM
, 3-Way SLI
TM
and SLI
TM
To Next Page
Loading...
Need help?
General
