Asus F1A55-M - Product Specifications and Package; Specifications Summary

viii
(continued on the next page)
F1A55-M LX3 R2.0 Series specications summary
APU AMD
®
A- & E2- series accelerated processors with AMD
®
Radeon™ HD
6000 series graphics, up to 4 CPU cores, FM1 package
DirectX
®
11 support
AMD
®
Turbo Core Technology 2.0 support*
* The AMD
®
Turbo Core Technology 2.0 support depends on the APU
types.
** Refer to www.asus.com for the AMD
®
CPU support list.
Chipset AMD
®
A55 FCH (Hudson D2)
Memory Dual-channel memory architecture
2 x 240-pin DIMM slots support maximum 32GB unbuffered non- ECC
DDR3 1866 / 1600 / 1333 / 1066 MHz memory modules
* The maximum 32GB memory capacity can be supported with 16GB or
above DIMMs. ASUS will update the memory QVL once the DIMMs are
available in the market.
** Refer to www.asus.com for the latest Memory QVL (Qualied Vendors
List).
*** When you install a total memory of 4GB capacity or more, Windows
®
32-bit operating system may only recognize less than 3GB. We
recommend a maximum of 3GB system memory if you are using a
Windows
®
32-bit operating system.
Graphics Integrated AMD
®
Radeon™ HD 6000 series graphics in the LIano APU
Supports D-Sub with max. resolution up to 1920 x 1600 @60Hz
Supports Microsoft
®
DirectX 11
Expansion slots 1 x PCIe 2.0 x16 slot
1 x PCIe 2.0 x1 slot
1 x PCI slot
Storage / RAID AMD
®
A55 FCH southbridge:
- 4 x Serial ATA 3.0Gb/s connectors support RAID 0, RAID 1, RAID 10,
and JBOD congurations
LAN Qualcomm Atheros
®
8161 Gigabit LAN controller
Audio Realtek
®
ALC887 3-jack 8-channel High Denition Audio CODEC*
* Use a chassis with HD audio module in the front panel to support an
8-channel audio output.
USB AMD
®
A55 FCH southbridge:
- 8 x USB 2.0/1.1 ports (4 ports at the mid-board, 4 ports at the back
panel)