AMD
®
Cool ‘n’ Quiet Technology
This motherboard supports the AMD
®
Cool ‘n’ Quiet technology which
monitors system operation and automatically adjusts CPU voltage and
frequency for a cool and quiet operating environment.
HyperTransport™ 3.0 support
HyperTransport™ 3.0 technology provides 2.6 times more bandwidth
than HT1.0 that radically improves system efciency for a smoother and
faster computing environment.
Dual-Channel DDR3 2000(O.C.) support
This motherboard supports DDR3 memory that features data transfer
rates of 2000 (O.C.) / 1866 (O.C.) / 1800 (O.C.) / 1600 (O.C.) / 1333/
1066 MHz to meet the higher bandwidth requirements of the latest
operating system, 3D graphics, multimedia, and Internet applications.
USB 3.0 support
Experience ultra-fast data transfer at 4.8Gbps with USB 3.0 – the latest
connectivity standard. Built to connect easily with next-generation
components and peripherals, USB 3.0 transfers data 10x faster and is
also backward compatible with USB 2.0 components.
Gigabit LAN solution
The onboard LAN controller is a highly integrated Gb LAN controller. It is
enhanced with an ACPI management function to provide efcient power
management for advanced operating systems.
Serial ATA 3Gb/s technology and RAID support
This motherboard supports hard drives based on the Serial ATA (SATA)
3Gb/s storage specication, delivering enhanced scalability and doubling
the bus bandwidth for high-speed data retrieval and save. It also supports
RAID 0, RAID 1, and RAID 10 congurations for Serial ATA hard drives.
8-channel high denition audio
Enjoy high-end sound quality on your PC! The onboard 8-channel High
Denition Audio CODEC enables high-quality 192KHz/24-bit audio
output, jack-sensing feature, and multi-streaming technology that
simultaneously sends different audio streams to different destinations.
You can now talk to your partners on the headphone while playing multi-
channel network games.
100% All High-quality Conductive Polymer Capacitors
This motherboard uses all high-quality conductive polymer capacitors for
durability, improved lifespan, and enhanced thermal capacity.
Chapter 1: Product introduction1-2
To Next Page
Loading...
