Asus P8H61-M LX REV 3.0 - P8 H61-M LX Specifications Summary

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P8H61-M LX specications summary
(continued on the next page)
CPU LGA1155 socket for Intel
®
Second Generation Core™ i7 / Core™
i5 / Core™ i3 processors
Supports 32nm CPU
Supports Intel
®
Turbo Boost Technology 2.0
* The Intel
®
Turbo Boost Technology 2.0 suppport depends on the
CPU types;
** Refer to www.asus.com for Intel
®
CPU support list.
Chipset Intel
®
H61 (B3) Express Chipset
Memory 2 x DIMM, max. 16GB, DDR3 1333 / 1066 MHz, non-ECC,
un-buffered memory
Dual-channel memory architecture
Supports Intel
®
Extreme Memory Prole (XMP)
* The Max. 16GB memory capacity can be supported with DIMMs
of 8GB (or above). ASUS will update QVL once the DIMMs are
available in the market.
** Refer to www.asus.com for the latest Memory QVL (Qualied
Vendors List).
*** When you install a total memory of 4GB capacity or more,
Windows
®
32-bit operating system may only recognize less
than 3GB. We recommend a maximum of 3GB system memory
if you are using a Windows
®
32-bit operating system.
Graphics Intel
®
Quick Sync Video Technology Support
Supports Microsoft
®
DirectX 10.1
Supports D-Sub with max. resolution up to 2048x1536 @75Hz
Expansion slots 1 x PCI Express 2.0 x16 slot
3 x PCI Express 2.0 x1 slots
Storage
Intel
®
H61 (B3) Express Chipset:
- 4 x Serial ATA 3.0 Gb/s connectors
LAN
Realtek
®
8111E PCIe Gigabit LAN controller
Audio ALC887 8-channel High Denition Audio CODEC
* Use a chassis with HD audio module in the front panel to
support an 8-channel audio output.
USB Intel
®
H61 (B3) Express Chipset:
- 10 x USB 2.0/1.1 ports (6 ports at the mid-board, 4 ports at
the back panel)
ASUS unique
features
ASUS EPU
ASUS Anti-Surge Protection
ASUS UEFI BIOS
ASUS AI Suite II
ASUS AI Charger
ASUS ESD
ASUS Low EMI
ASUS CrashFree BIOS 3
ASUS EZ Flash 2
ASUS MyLogo 2™
ASUS Fanless Design: Stylish Heatsink Solution
ASUS Fan Xpert