IMPORTANT CONCERNS
WHEN MOVING YOUR SPLICE DETECTION
HOLE PUNCH FROM ONE DIE TO ANOTHER
In late 1997 we made a design change to our basic strip joining dies. This change involved making both upper and
lower die shoes thicker by approximately 11/16” (17 ½ mm). This change also eliminated the mounting plates and made
the entire unit more rigid.
This change also created a serious problem when a splice detection hole punch assembly is removed from an old style
die and placed in a new style die. The result will be considerable damage to the entire die assembly.
Do not, under any circumstances, remove a hole punch assembly from an
old style die and place it in a new style die. Any damage resulting from this
is excluded from any and all warrantees.
To best determine whether you can interchange your hole punch assembly from one die to another, measure the thick-
ness of the die shoe in both dies. If there is a thickness difference of more than 0.125” (3mm), please consult Behlen
Mfg. Co. before proceeding.
F-19853 7-18-02
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