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Blu VIVO 4.8 User Manual

Blu VIVO 4.8
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BLU VIVO 4.8
Service Manual
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Blu VIVO 4.8 Specifications

General IconGeneral
Resolution720 x 1280 pixels (~306 ppi pixel density)
ProtectionCorning Gorilla Glass 3
ChipsetMediaTek MT6582
CPUQuad-core 1.3 GHz Cortex-A7
GPUMali-400MP2
RAM1 GB
Video1080p@30fps
Selfie Camera5 MP
Alert typesVibration; MP3, WAV ringtones
LoudspeakerYes
3.5mm jackYes
WLANWi-Fi 802.11 b/g/n, Wi-Fi Direct, hotspot
Bluetooth4.0, A2DP
GPSYes, with A-GPS
RadioFM radio
USBmicroUSB 2.0
MessagingSMS(threaded view), MMS, Email, Push Email, IM
BrowserHTML5
JavaNo
SIMDual SIM
Display Size4.8 inches
Main Camera13 MP
Main Camera FeaturesLED flash
SensorsAccelerometer
Battery2000 mAh
ColorsBlack, White

Summary

2. Signal Flow and Fault Analysis

2.1. RF Part

Analysis of the Radio Frequency (RF) section.

2.1.1. Block Diagram of the RF Section

Block diagram illustrating the RF section of the device.

2.1.2. Signal Flow of the RF Transmitting Part

Details the signal flow for RF transmission, including the transmitting path.

2.1.3. Signal Flow of the RF Receiving Part

Details the signal flow for RF reception, including receiving path components.

2.2. Baseband Part

Covers the baseband processing unit and its functions.

2.2.1. Block Diagram of the Baseband Part

Block diagram of the baseband processing unit.

2.2.2. Power Management

Explains the power management module and system with voltage/current details.

2.2.3. Audio Section

Details the audio system components, including the codec, MIC, receiver, and headset circuits.

2.2.4. Baseband Fault Issues

Maintenance process for baseband download failures.

2.2.4.1 Analysis of the keyboard fault

Analyzes keyboard faults and troubleshooting steps.

2.2.4.2 Analysis of Display module circuit

Analyzes faults in the display module circuit.

2.2.4.3 FM Module

Details the FM module design and circuit.

2.2.4.4 Camera Module

Details the camera module and common malfunction causes.

2.2.4.5 IO Interface

Covers the IO interface for USB, charging, and download functions.

2.2.4.6 SIM Card Circuit

Details the SIM card circuit and dual SIM integration.

2.2.4.7 BT/WIFI/GPS Circuit

Details the integrated BT/WIFI/GPS circuit.

2.2.4.8 G-sensor Circuit

Details the G-sensor circuit and its components.

2.2.4.9 M-sensor Circuit

Details the M-sensor circuit and its components.

2.2.4.10 Gyroscope Circuit

Details the gyroscope circuit and its components.

1. Outline

1.1. Mobile Introduction

Overview of the mobile device's introduction and hardware.

1.2. Motherboard Components Distribution

Distribution of components on the motherboard.

3. Service Tools/Equipment List

Iron and Heating Equipment

Essential tools like soldering iron, hot air station, and power supplies.

Measurement and Handling Tools

Tools for measurement and testing electronic components.

Computer and Software Tools

Computer setup for software download and device interaction.

Soldering and ESD Protection Tools

Materials for soldering and protective gear for static discharge.

Precision Handling Tools

Tools for precise component manipulation and assembly.

4. Disassembly Instruction

Device Disassembly Steps

Visual guide to disassembling the mobile device.

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