Dell D17S005 - Umgebungsbedingungen

Tabelle 21. Hardware security (fortgesetzt)
Hardware security
Padlock ring
Chassis lock slot support
Chassis intrusion switch
Lockable cable covers
Supply chain tamper alerts
SafeID including Trusted Platform Module (TPM) 2.0
Smart card keyboard (FIPS)
Microsoft 10 Device Guard and Credential Guard (Enterprise SKU)
Microsoft Windows Bitlocker
Local hard drive data wipe through BIOS (Secure Erase)
Self-encrypting storage drives (Opal, FIPS)
Trusted Platform Module TPM 2.0
China TPM
Intel Secure Boot
Intel Authenticate
SafeBIOS: includes Dell Off-host BIOS Verification, BIOS Resilience, BIOS Recovery, and additional BIOS Controls
OptiPlex SFF Cable Cover
Umgebungsbedingungen
Die folgende Tabelle enthält die Umgebungsbedingungen für das OptiPlex Small Form Factor Plus 7010-System.
Tabelle 22. Environmental
Feature Values
Recyclable packaging Yes
BFR/PVC—free No
Vertical orientation packaging support No
Multi-Pack packaging Yes
Energy-Efficient Power Supply Standard
ENV0424 compliant Yes
ANMERKUNG: Wood‐based fiber packaging contains a minimum of 35% recycled content by total weight of wood‐based
fiber. Packaging that contains without wood‐based fiber can be claimed as Not Applicable. The anticipated required criteria
for EPEAT 2018.
Technische Daten des OptiPlex Small Form Factor Plus 7010 29