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General| Brand | entegris |
|---|---|
| Model | A192-81M-0215 |
| Category | Industrial Equipment |
| Language | English |
Dimensions critical for equipment interface and carrier placement, illustrated with diagrams.
Covers pocket width, depth, and overall pocket size for wafer carriers.
Explains the goal of specifying wafer plane dimensions for predictable placement.
Lists advantages of improved wafer plane, like reduced adjustments and errors.
Clarifies terms like wafer plane, offset dimension, and datums A and B.
Defines wafer plane using offset dimension and tolerance from Datum A.
Provides typical offset and tolerance ranges for wafer plane specifications.
Discusses how wafer plane affects automated handling and potential issues.
Shows where the four contact points are located on the carrier for support.
Explains how four-point contact ensures correct orientation and stable placement.
Guidance on designing equipment interfaces for planar support of contact points.
Lists carrier models and their four-point contact feature configurations.
Stresses using specific, controlled dimensions for reliable wafer carrier interfaces.
Advises designing interfaces based on controlled dimensions detailed on prints.
Highlights the importance of using full tolerance ranges for interface development.
Explains how interface design can minimize particle generation through smooth surfaces.
Advises using specific contact points for optimal horizontal wafer handling.
Guidance on designing interface plates for horizontal wafer carrier placement.
Lists optimal contact areas (A+B) for horizontal wafer carrier handling.
Lists suboptimal contact combinations (A+B+C, B+C) for horizontal handling.
Specifies dimensions D6a and D5b for Area A interface in horizontal handling.
Specifies dimension D6b for Area B interface in horizontal handling.
Specifies dimensions D6a and D4a for Area C interface in horizontal handling.
Advises using specific contact points for accurate vertical wafer handling.
Describes an interface plate for vertical carrier registration using center notches.
Identifies the primary contact area (A+B+C) for vertical wafer carrier handling.
Details Center Notch use for accurate vertical registration of wafer carriers.
Specifies track recess and four-point contact for B & C in vertical handling.
Advises referencing specific carrier specs for robotic interface design.
Categorizes features like endwall flanges, handles, and top flanges for robotics.
Describes outboard and inboard flanges for robotic gripping on endwalls.
Explains flanges on the "H" bar end for robotic handling, avoiding inside surface interference.
Details endwall handles for carrier manipulation, placed for balance.
Describes top flanges used for less precise robotic movement and placement.
How properties like stability, static, and moisture affect equipment interface.
Material's ability to maintain dimensions over time for reliable interface.
Material's ability to prevent static charge buildup and discharge.
How much moisture a material absorbs, affecting vacuum pump down times.
Categorizes carriers into wafer transport and process types based on use.
Defines transport carriers and lists standard material definitions.
Defines process carriers, highlighting chemical resistance and PFA material.
Provides detailed data on static protection, moisture, temperature, and flammability.
Lists maximum continuous use and insertion temperatures for various materials.
Shows flammability ratings for different carrier materials.
Provides contact details and website for further inquiries and service.
Directs users to the website for viewing and printing sale terms and conditions.
Guides users to the website for accessing product warranty information.
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