Heathkit SB-10 - Page 23

ASSEMBLY
AND WIRING
OF
THE BALANCED
MODULATOR
SUB-CHASSIS
Refer to
Pictorials 4 and 5 for
parts
mounti.ng
and
wiring.
(
v"I Mount 9
pin
shielded
ceramic
sockets
at locations
,Ait
and
"8".
Position vacant
pin
space
as shown
in the
Pictorial. Place a small #6 solder Iug under
the mounting
hardware near-
est
pins
4
and 5 of each
socket. Secure
with
#3
lockwasher
and 3-48 nuts.
CAUTION:
Carefully inspect
the bandswitch
63-158and note
the
position
of the key
marks on the
wafer
rotors.
Both should be on the same side of the
switch shaft.
If not, during
disassembly,
remove
the front
deck and replace with
thekey
markinlinewith
thereardeck
key
mark, Check
the
detailed
Efiiiswitdh drawing in Figure 8 which
shortrs theswitchinfuU
Ccwposition. Notethe
propgr
relation
between the
shaft
flat
and
the wafer key
marks and
contact
arrangement.
(
/)
Disassemble
band switch 63-158 and
reassemble
to the sub-chassis
as shown in
Figure
8.
Insert the coil
and two wafer assembly
on the
band switch as
shown
placing
the waf6r
with
lugs at BS3-2
and BS3-5 toward the rear. During reassembly,
use care to
observe
proper
orientation
of the wafers and index
plate per
the detailed drawing.
Make
sure a
fiber
washer
is
placed
betrveen the ceramic wafer and the metal spacer.
BALANCED
MODULATOR
3UB-CHASSIS
EANDSIVITCH
SHOIVN
FULL
CCW
POSITION
63-
t:t8
|''2
COIL
A
TWO
WAFE
B
ASSEMILY
a,
1,
""Y
oo
ff
t2
BANDSWITCH
&
BALANCED
MODULATOR
SU8-CHASSIS
ASSEMBLY
Figure
I
Page
23