hilscher netRAPID 90 - Chip Carrier; Default Chapter; Table of Contents

Table of contents 2/108
Table of contents
1 Introduction .............................................................................................................................. 5
1.1 About this document ........................................................................................................5
1.2 List of revisions ................................................................................................................5
1.3 References to documents ................................................................................................5
2 Product concept and overview............................................................................................... 6
2.1 Concept netRAPID 90......................................................................................................6
2.1.1 Companion solution: Preloaded communication module.................................. 6
2.1.2 Stand-alone solution: Programming platform like a netX chip .......................... 7
2.1.3 One design with different memory options........................................................ 8
2.2 Overview netX90 base technology...................................................................................9
2.2.1 Features netX90 ............................................................................................... 9
2.2.2 Internal structure of the netX90......................................................................... 9
2.2.3 Security concept netX90 and netX90 based products .................................... 10
2.2.4 Software concept netX90 and netX90 based products................................... 10
2.3 Overview netRAPID 90 ..................................................................................................12
2.3.1 Features netRAPID 90.................................................................................... 12
2.3.2 Requirements for design-in............................................................................. 12
2.3.3 Connections overview..................................................................................... 13
2.3.4 Benefits of netRAPID90 .................................................................................. 14
2.4 netRAPID 90 variants.....................................................................................................15
2.4.1 Overview netRAPID 90 products .................................................................... 15
2.4.2 Memory options .............................................................................................. 15
2.4.3 Preloaded vs. open platform ........................................................................... 16
2.5 Solutions for typical applications ....................................................................................17
2.5.1 Companion solution providing a fixed layout .................................................. 17
2.5.2 Stand-alone solution providing a flexible layout.............................................. 17
3 Mechanics............................................................................................................................... 18
3.1 Dimension ......................................................................................................................18
3.2 Design guidelines for the host system ...........................................................................19
3.2.1 Footprint.......................................................................................................... 19
3.2.2 Thermal behavior and thermal pad ................................................................. 20
3.2.3 VIAs and signal fan out underneath the netRAPID device ............................. 20
3.3 Tempering, storage and soldering .................................................................................21
3.4 Matrix label.....................................................................................................................22
4 Electrical aspects common for both solutions ................................................................... 23
4.1 Location of pins ..............................................................................................................23
4.2 General signals ..............................................................................................................23
4.2.1 Supply voltage ................................................................................................ 23
4.2.2 Reset signals .................................................................................................. 24
4.2.3 Boot signal and boot options........................................................................... 25
4.3 Real-Time Ethernet interface .........................................................................................27
4.3.1 Interface description........................................................................................ 27
4.3.2 Design recommendations ............................................................................... 28
4.4 Diagnostic interfaces......................................................................................................31
4.4.1 Serial interface – UART .................................................................................. 31
4.4.2 JTAG Debugging interface.............................................................................. 32
netRAPID 90 | Design guide
DOC190601DG01EN | Revision 1 (Draft 10) | English | 2019-09 | Preliminary | Public
© Hilscher 2019