HP 240 G2 Disassembly Instructions

EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category:
Notebooks and Tablet PCs
Marketing Name / Model
[List multiple models if applicable.]
HP 240 G2 Notebook PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0
Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
Mother board
1
Batteries All types including standard alkaline and lithium coin
or button style batteries Battery Pack,RTC
2
Mercury-containing components For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps LCD
1
Cathode Ray Tubes (CRT) 0
Capacitors / condensers (Containing PCB/PCT) 0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords 0
Gas Discharge Lamps 0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0

HP 240 G2 Specifications

General

Form factor	Clamshell
Product type	Laptop
Product color	Black
Country of origin	China
Bus type	DMI
Stepping	L1
Tjunction	90 °C
Processor cache	3 MB
Processor cores	2
Processor model	i3-3110M
System bus rate	5 GT/s
Processor family	Intel® Core™ i3
Processor series	Intel Core i3-3100 Mobile Series
Processor socket	BGA 1023
Processor threads	4
Processor codename	Ivy Bridge
Processor frequency	2.4 GHz
Processor cache type	Smart Cache
Processor lithography	22 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	2.0
Processor operating modes	64-bit
ECC supported by processor	No
PCI Express configurations	1x16, 2x8, 1x8+2x4
Thermal Design Power (TDP)	35 W
CPU multiplier (bus/core ratio)	24
Maximum number of PCI Express lanes	16
Motherboard chipset	Intel HM76 Express
Memory slots	2x SO-DIMM
Internal memory	4 GB
Memory clock speed	1600 MHz
Memory form factor	SO-DIMM
Internal memory type	DDR3-SDRAM
Maximum internal memory	- GB
Memory layout (slots x size)	1 x 4 GB
HDD speed	5400 RPM
HDD interface	SATA
Storage media	HDD
Optical drive type	DVD Super Multi DL
Card reader integrated	Yes
Total storage capacity	500 GB
Compatible memory cards	SD
Number of HDDs installed	1
Display surface	-
Display diagonal	14 \
Display resolution	1366 x 768 pixels
Native aspect ratio	16:9
On-board graphics card ID	0x166
Discrete graphics card model	Not available
On-board graphics card model	Intel® HD Graphics 4000
On-board graphics card family	Intel® HD Graphics
On-board graphics card base frequency	650 MHz
On-board graphics card dynamic frequency (max)	1000 MHz
Front camera resolution	1280 x 720 pixels
Wi-Fi standards	802.11b, 802.11g, Wi-Fi 4 (802.11n)
Bluetooth version	4.0
Ethernet LAN data rates	10, 100, 1000 Mbit/s
Charging port type	DC-in jack
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
eSATA/USB 2.0 ports quantity	0
Pointing device	Touchpad
Operating system installed	Windows 8.1
Processor code	SR0N2
Processor ARK ID	65700
Processor package size	37.5 x 37.5 (rPGA988B); 31 x 24 (BGA1023) mm
Supported instruction sets	AVX
Intel Identity Protection Technology version	1.00
Battery capacity	41 Wh
Battery life (max)	- h
AC adapter power	65 W
Sustainability certificates	ENERGY STAR

Weight and Dimensions

Depth	240 mm
Width	346 mm
Height	28.1 mm
Weight	2200 g