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MF877-00 Page 2

Template Revision A

HPE instructions for this template are available at MF877-01

Tool Description

Tool Size (if

applicable)

Phillips Screwdriver

Diagonal Pliers

5”

Hexagonal Socket Screwdriver

Plat Screwdriver

4mm

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Using a P2 Phillips Screwdriver, remove all 12 screws securing top cover to chassis. Remove Cover. (see 3.2.1)

2. Using a P2 Phillips Screwdriver, remove 9 screws to chassis, remove Air baffle (3pcs). (see 3.2.2)

3. Using Diagonal Plier to cut 1 cable tie on chassis and Disconnect Power supply and main board cable connections (3 cables

connections in all), remove Power supply and insulator (1pcs). (see 3.2.3)

4. Using a P2 Phillips Screwdriver, remove 8 screws to chassis, remove PoE board and insulator (1pcs), remove SFP heat sink,

remove cable tie. (see 3.2.4)

5. Disconnect Fan and main board 2 cables connection and Using a P2 Phillips Screwdriver, remove 4 screws to chassis, remove

Fan(2pcs) (see 3.2.5)

6. Using a P2 Phillips Screwdriver, remove 7 screws to chassis, using a #5 Hexagonal socket Screwdriver, remove 7 standoffs to

chassis, remove main board (1pcs). (see 3.2.6)

7. Using Diagonal Plier to cut 1 cable tie on rear plane, Using Flat Screwdriver push the hooks on the sides of AC-inlet Socket, and

Using a P2 Phillips Screwdriver, remove 1 screws to chassis and Disconnect ac-inlet cable (see 3.2.7)

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the

product that require selective treatment (with descriptions and arrows identifying locations).

3.2.1

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HP Aruba Instant On 1830 Specifications

General