HP Compaq dc7800 Quickspecs

Packaging Materials Corrugated Paper 1687 g
EPE Foam 308 g
LDPE Bag 63 g
The EPE foam packaging material is made from 30 to 40% industrial recycled content.
The corrugated paper packaging materials contains at least 25% post consumer recycled content.
Ultra-slim Desktop, Small Form Factor, Convertible Minitower
RoHS Compliance Hewlett-Packard is committed to compliance with all applicable environmental laws and regulations,
including the European Union Restriction of Hazardous Substances (RoHS) Directive. HP's goal is to exceed
compliance obligations by meeting the requirements of the RoHS Directive on a worldwide basis. From
July 1, 2006, RoHS substances will be virtually eliminated (virtually = to levels below legal limits) for all HP
electronic products subject to the RoHS Directive, except where it is widely recognized that there is no
technically feasible alternative (as indicated by an exemption under the EU RoHS Directive).
Material Usage This product does not contain any of the following substances in excess of regulatory limits (refer to the
HP General Specification for the
Environment at: http://www.hp.com/hpinfo/globalcitizenship/environment/
supplychain/gen_specifications.html ):
Asbestos
Certain Azo Colorants
Certain Brominated Flame Retardants – may not be used as flame retardants in plastics
Cadmium
Chlorinated Hydrocarbons
Chlorinated Paraffins
Formaldehyde
Halogenated Diphenyl Methanes
Lead carbonates and sulfates
Lead and Lead compounds
Mercuric Oxide Batteries
Nickel – finishes must not be used on the external surface designed to be frequently handled or
carried by the user.
Ozone Depleting Substances
Polybrominated Biphenyls (PBBs)
Polybrominated Biphenyl Ethers (PBBEs)
Polybrominated Biphenyl Oxides (PBBOs)
Polychlorinated Biphenyl (PCB)
Polychlorinated Terphenyls (PCT)
Polyvinyl Chloride (PVC) – except for wires and cables, and certain retail packaging has been
voluntarily removed from most applications.
Radioactive Substances
Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)
Packaging HP follows these guidelines to decrease the environmental impact of product packaging:
Eliminate the use of heavy metals such as lead, chromium, mercury and cadmium in packaging
materials.
Eliminate the use of ozone-depleting substances (ODS) in packaging materials.
Design packaging materials for ease of disassembly.
Maximize the use of post-consumer recycled content materials in packaging materials.
Use readily recyclable packaging materials such as paper and corrugated materials.
Reduce size and weight of packages to improve transportation fuel efficiency.
QuickSpecs
HP Compaq dc7800 Business PC
Technical Specifications - Environmental Data
DA - 12744 North America — Version 33 — October 29, 2008 Page 66

HP Compaq dc7800 Specifications

General

Tcase	73.3 °C
Bus type	FSB
Stepping	M0
Processor cache	2 MB
Processor cores	2
Processor model	E4600
System bus rate	- GT/s
Processor family	Intel® Core™2 Duo
Processor series	Intel Core 2 Duo E4000 Series
Processor socket	LGA 775 (Socket T)
Processor codename	Conroe
Processing Die size	111 mm²
Processor frequency	2.4 GHz
Processor cache type	L2
Processor lithography	65 nm
Processor manufacturer	Intel
Processor front side bus	800 MHz
Processor operating modes	64-bit
ECC supported by processor	No
Thermal Design Power (TDP)	65 W
CPU multiplier (bus/core ratio)	12
Number of Processing Die Transistors	167 M
Internal memory	1 GB
Internal memory type	DDR2-SDRAM
Maximum internal memory	8 GB
Memory layout (slots x size)	2 x 0.5 GB
HDD speed	7200 RPM
HDD interface	SATA
Optical drive type	DVD Super Multi
Total storage capacity	160 GB
Audio input	1
LightScribe	Yes
Networking features	Intel 82566DM Gigabit Network Connection
Graphics card RAMDAC	400 MHz
Storage drive controller	SATA 3, 0 Gb/s NCQ SMART VI
Discrete graphics card model	Intel® GMA 3100
Maximum graphics card memory	0.256 GB
Operating system installed	Windows Vista Business
USB 2.0 ports quantity	8
Chassis type	Mini Tower
Country of origin	China
Cable lock slot type	Kensington
Operating altitude	0 - 3048 m
Non-operating altitude	0 - 9144 m
Storage temperature (T-T)	-30 - 60 °C
Operating temperature (T-T)	10 - 35 °C
Storage relative humidity (H-H)	5 - 95 %
Operating relative humidity (H-H)	10 - 90 %
Power supply	365 W
Product type	PC
Processor code	SLA94
Processor ARK ID	32242
Processor package size	37.5 x 37.5 mm

Weight and Dimensions

Depth	452 mm
Width	177 mm
Height	447 mm
Weight	11800 g