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EL-MF877-00 Page 2

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Components, parts and materials containing

radioactive substances

N/A

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Description #1 Phillips T8 screwdriver for

#T8 2.0~2.5

kg-cm

Description #2 Phillips # 0 screwdriver

#0 2.0~2.5

kg-cm

Description #3 Phillips #1 screwdriver

#1 2.0~2.5

kg-cm

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Use tool #1 Release base cover T8 screw 9PCS,and from hinge side release base cover

2. Use tool #2 Release battery pack screw 8PCS and release Battery Conn.

3. Use tool #3 Release main board screw 12PCS

4. Release below cable Speaker cable NFC cable,KB cable,TP cable ,HDD cable ,Power button cable ,CCD cable,LCD

cable ,WWan antenna cable,Wlan cable

5. release Main board

6. release hinge screw and remove hinge up

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

3.21 Use tool #1 Release base cover T8 screw 9PCS, and from hinge side release base cover

3.22 Use tool #2 Release battery pack screw 8PCS and release Battery Conn.

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