EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
radioactive substances
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Size (if
applicable)
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove access panel
2. Remove all add-on cards
3. Remove all cables from main board and devices
4. Remove front bezel and hood lock
5. Remove SD card reader and ODD
6. Remove all equipped HDD
7. Remove PSU
8. Remove M/B
9. Remove 95W / 65W heat sink from M/B
10. Remove DDR and battery from M/B
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
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