EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
radioactive substances
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Size (if
applicable)
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Lay the Monitor on the desk, tack out the stand with hand
2. Unlock the 4 PCS screws
3. Take out the back cover with hand.
4. Take out the Keypad line with hand.
5. Take out the tapes with hand and take out the LED line
6. Take out the foils with hand
7. Take out the tape and take out the LVDS
8. Take out the chassis ASM with hand
9. Take out the foil with handTake out the panel and Bezel ASM
10. Take out the top chassis mylar with hand
11. Unlock the 2 screws and take out the keypad
12. Unlock the 3 Screws
13. Unlock the 1 Screws and take out the USB cover ASM
14. Take out the USB line
15. Unlock the 2 screws and take out the USB board
16. Take out the mylar
17. Unlock the 7 screws and take out the PCBA with hand
18. Take out the lines with hand
19. Take out the rubber cap and mylars with hand
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Below action which may easily damage product .please notice it
Lay the
Monitor on
the desk, tack
out the stand
with hand
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