EL-MF877-00 Page 2
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Item Description Notes
items
included in
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations. NA
0
Components and waste containing asbestos
Components, parts and materials containing refractory
ceramic fibers
Components, parts and materials containing
radioactive substances
List the type and size of the tools that would typically be used to disassemble the product to a point where components and
materials requiring selective treatment can be removed.
Tool Size (if
applicable)
Description T15 screw driver (Disassemble 2 pcs screws for PCI bkt)
Description T15 screw driver (Disassemble 2 pcs screws for PC board )
Description T15 screw driver (Disassemble 7 pcs screws for MB )
Description T15 screw driver (Disassemble 7 pcs screws for FAN )
Description T15 screw driver (Disassemble 7 pcs screws for PSU )
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:
1. Push button to remove Panel from housing.
2. Pull off HDD SATA con &HDD power con.
3. Remove HDD from housing
4. Remove front bezel from housing
5. Loosen 2 screw on main bkt
6. Remove PCI card from housing
7. Loosen 2 screw on main bkt then remove it
8. Pull off all cables on MB then Loosen 7 screw
9. Loosen 4 screws on bkt then remove Fan module
10. Loosen 4 screws on bkt then remove PSU module
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