EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
List the type and size of the tools that would typically be used to disassemble the product to a point where
components and materials requiring selective treatment can be removed.
Tool Size (if
applicable)
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective
treatment:
1) Place the system face down
2) Disassemble hinge cover & access door
3) Disassemble stand
4) Remove ODD&TOP Perf (grill)
5) Disassemble rear cover
6) Disassemble HDD
7) Disassemble CPU&I/O Shielding
8) Disassemble stand support
9) Disassemble CPU H/S
10) Disassemble speaker
11) Unplug cable
12) Disassemble ODD& HDD cable and fan
13) Disassemble WLAN
14) Disassemble INVERTER
15) Disassemble MB and MB Battery
16) Remove CPU & DDR
17) Disassemble power switch card
18) Disassemble webcam & antenna cable
19) Disassemble basepan
20) Disassemble LCD
21) Separate BASE pan& beze
22) Remove CCFLs from panel (up to 4)
23) Remove Battery from MB, KB & Mouse.
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