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HP Pavilion 23xi

HP Pavilion 23xi
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EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screw driver
PH2
Hex nut screwdriver
M5
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Quick release Base stand
2. Strip the screws from rear cover so that the rear metal cover can be removed , after be turn back;
3. Strip the five screws from panel holder
4. Push up and disassemble the cover from the panel
5. To remove the shielding(contain the other material )
6. Strip the screws
7. Release all materials and put some by ESD
3.2 Optional : Depending upon the complexity of the disassembly process, a graphic depicting the locations of items contained within
the product which require selective treatment (with descriptions and arrows identifying locations) can be inserted below:

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