EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
radioactive substances
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Size (if
applicable)
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Disassemble the slate & docking ass'y
2. Remove battery cable from connecter on MB
3. Disassemble bezel ass'y from A-cover ass'y
4. Remove LCD cable with touch glass control board
5. Release SPK L&R screw *4 pcs
6. Remove speaker L&R
7. Release slate pogo connecter screw *2 pcs
8. Release pogo cable connecter on MB
9. Remove the pogo cable & RTC battery
10. Release battery screw *4 pcs
11. Remove battery pack
12. Release ssd screw *1 pcs
13. Remove ssd card
14. Release antenna connecter *2
15. Release antenna board screw *1 pcs
16. Remove antenna board
17. Release power & audio & usb ffc connecter on MB
18. Release camera cable connecter on MB
19. Release MB screw *6 pcs
20. Release MG bracket *1 pcs
21. Remove Mother Board
22. Release MG bracket screw *3 pcs
23. Remove MG bracket
24. Release audio board screw *3 pcs
25. Remove audio bracket
26. Release ffc connecter on audio board
27. Remove audio bord
28. Remove audio and usb ffc
29. Release ffc connecter on vol. board
30. Release vol. board screw *2 pcs
31. Remove vol.board
32. Remove vol. ffc
33. Release ffc connecter on power board
34. Release power board screw *1 pcs
35. Remove power board
36. Remove power ffc
37. Release camera cable connecter on camera module
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