EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
radioactive substances
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Size (if
applicable)
Description #1 screw driver
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove access panel from the unit
2. Take off the front bezel from the unit.
3. Remove ODD from the unit.
4. Remove HDD from the unit.
5. Remove all the cables from PCA
6. Take off Memory and graphic card
7. Take off FIO from the unit,
8. Take off CPU Cooler.
9. Take off CMOS battery
10. Take off system fan
11. Take off PCA from the Unit
12. Take off PSU from the Unit
13. Open the PSU.
14. Remove the Electrolytic capacitors from the PSU (up to 8)
15.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
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