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HP ProBook 430 G3 User Manual

HP ProBook 430 G3
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Grounding guidelines
Electrostatic discharge damage
Electronic components are sensitive to electrostatic discharge (ESD). Circuitry design and structure determine
the degree of sensitivity. Networks built into many integrated circuits provide some protection, but in many
cases, ESD contains enough power to alter device parameters or melt silicon junctions.
A discharge of static electricity from a nger or other conductor can destroy static-sensitive devices or
microcircuitry. Even if the spark is neither felt nor heard, damage may have occurred.
An electronic device exposed to ESD may not be aected at all and can work perfectly throughout a normal
cycle. Or the device may function normally for a while, and then degrade in the internal layers, reducing its life
expectancy.
CAUTION: To prevent damage to the computer when you are removing or installing internal components,
observe these precautions:
Keep components in their electrostatic-safe containers until you are ready to install them.
Use nonmagnetic tools.
Before touching an electronic component, discharge static electricity by using the guidelines described in this
section.
Avoid touching pins, leads, and circuitry. Handle electronic components as little as possible.
If you remove a component, place it in an electrostatic-safe container.
The following table shows how humidity aects the electrostatic voltage levels generated by dierent
activities.
CAUTION: A product can be degraded by as little as 700 V.
Typical electrostatic voltage levels
Relative humidity
Event 10% 40% 55%
Walking across carpet 35,000 V 15,000 V 7,500 V
Walking across vinyl oor 12,000 V 5,000 V 3,000 V
Motions of bench worker 6,000 V 800 V 400 V
Removing DIPS from plastic tube 2,000 V 700 V 400 V
Removing DIPS from vinyl tray 11,500 V 4,000 V 2,000 V
Removing DIPS from Styrofoam 14,500 V 5,000 V 3,500 V
Removing bubble pack from PCB 26,500 V 20,000 V 7,000 V
Packing PCBs in foam-lined box 21,000 V 11,000 V 5,000 V
Service considerations 29

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HP ProBook 430 G3 Specifications

General IconGeneral
Power cord includedYes
Intel segment taggingEnterprise, Professional
AC adapter power45 W
Battery capacity44 Wh
Number of battery cells4
Operating system architecture64-bit
Numeric keypadNo
Pointing deviceTouchpad
Charging port typeDC-in jack
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Ethernet LAN (RJ-45) ports1
Thunderbolt ports quantity0
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity2
Wi-Fi standards802.11a, Wi-Fi 5 (802.11ac), 802.11b, 802.11g, Wi-Fi 4 (802.11n)
Bluetooth version4.2
Ethernet LAN data rates10, 100, 1000 Mbit/s
SSD capacityThe Solid State Drive's storage capacity in Gigabytes.
SSD interfaceSATA
Storage mediaSSD
SSD form factorM.2
Total storage capacity128 GB
Compatible memory cardsSD, SDHC, SDXC
On-board graphics card ID1916
Discrete graphics card modelNot available
On-board graphics card modelIntel® HD Graphics 520
On-board graphics card familyIntel® HD Graphics
Maximum on-board graphics card memory1.74 GB
On-board graphics card OpenGL version4.4
On-board graphics card base frequency300 MHz
On-board graphics card DirectX version12.0
On-board graphics card dynamic frequency (max)1000 MHz
Display diagonal13.3 \
Display resolution1366 x 768 pixels
Native aspect ratio16:9
Memory slots2x SO-DIMM
Internal memory4 GB
Memory clock speed1600 MHz
Internal memory typeDDR3L-SDRAM
Maximum internal memory16 GB
Memory layout (slots x size)1 x 4 GB
Form factorClamshell
Product typeLaptop
Product colorSilver
Country of originChina
Tcase- °C
Bus typeQPI
SteppingD1
Tjunction100 °C
Processor cache3 MB
Processor modeli5-6200U
System bus rate4 GT/s
Processor familyIntel® Core™ i5
Processor seriesIntel Core i5-6200 series
Processor socketLGA 1356 (Socket B2)
Processor codenameSkylake
Configurable TDP-up25 W
Number of QPI links-
Processor frequency2.3 GHz
Processor cache typeSmart Cache
Configurable TDP-down7.5 W
Processor lithography14 nm
Processor manufacturerIntel
Processor front side bus- MHz
PCI Express slots version3.0
Processor boost frequency2.8 GHz
PCI Express configurations1x4, 4x1
Thermal Design Power (TDP)15 W
Configurable TDP-up frequency2.4 GHz
Configurable TDP-down frequency0.8 GHz
Maximum number of PCI Express lanes12
Processor codeSR2EY
Processor ARK ID88193
Processor package size42 X 24 mm
Supported instruction setsSSE4.1, SSE4.2, AVX 2.0
Intel Smart Response Technology version1.00
Intel Stable Image Platform Program (SIPP) version0.00
Weight and Dimensions IconWeight and Dimensions
Depth233.7 mm
Width326 mm
Weight1500 g
Height (rear)22.4 mm
Height (front)21.4 mm

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