HP ProBook 470 G4 Product End-Of-Life Disassembly Instructions

EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Notebooks and Tablet PCs
Marketing Name / Model
[List multiple models if applicable.]
HP ProBook 470 G4 Notebook PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
M/B, USB Board, Power Board, Touchpad Module,
4
Batteries
All types including standard alkaline and lithium
coin or button style batteries RTC/Battery cell
2
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
1
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
power cord
1
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Components and waste containing asbestos

HP ProBook 470 G4 Specifications

General

Form factor	Clamshell
Product type	Laptop
Product color	Silver
Country of origin	China
Memory slots	2x SO-DIMM
Internal memory	8 GB
Memory clock speed	2133 MHz
Internal memory type	DDR4-SDRAM
Maximum internal memory	16 GB
Memory layout (slots x size)	1 x 8 GB
LED backlight	Yes
Display surface	Matt
Display diagonal	17.3 \
Intel segment tagging	Home Office, Small Business
On-board graphics card ID	0x5916
Discrete graphics card model	NVIDIA® GeForce® 930MX
On-board graphics card model	Intel® HD Graphics 620
Discrete graphics card memory	2 GB
Discrete graphics memory type	GDDR3
On-board graphics card family	Intel® HD Graphics
Maximum on-board graphics card memory	32 GB
On-board graphics card OpenGL version	4.4
On-board graphics card base frequency	300 MHz
On-board graphics card DirectX version	12.0
On-board graphics card dynamic frequency (max)	1050 MHz
SSD capacity	The Solid State Drive's storage capacity in Gigabytes.
Storage media	SSD
Optical drive type	DVD Super Multi DL
Total storage capacity	256 GB
Compatible memory cards	SD, SDHC, SDXC
Number of SSDs installed	1
Front camera signal format	720p
Wi-Fi standards	-
Bluetooth version	4.2
Ethernet LAN data rates	10, 100, 1000 Mbit/s
Number of built-in speakers	2
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
USB 3.2 Gen 2 (3.1 Gen 2) Type-A ports quantity	0
Sustainability certificates	EPEAT Gold, ENERGY STAR
Operating shock	40 G
Operating altitude	-15.24 - 3048 m
Non-operating shock	20 G
Operating vibration	0.75 G
Non-operating altitude	-15.24 - 12192 m
Non-operating vibration	1.5 G
Storage temperature (T-T)	-20 - 60 °C
Operating temperature (T-T)	0 - 35 °C
Storage relative humidity (H-H)	5 - 95 %
Operating relative humidity (H-H)	10 - 90 %
AC adapter power	65 W
Battery capacity	48 Wh
Number of battery cells	3
Keyboard layout	QWERTY
Pointing device	Clickpad
Bus type	OPI
Stepping	H0
Tjunction	100 °C
Processor cache	4 MB
System bus rate	4 GT/s
Processor family	Intel® Core™ i7
Processor socket	BGA 1356
Processor threads	4
Processor codename	Kaby Lake
Configurable TDP-up	25 W
Processor frequency	2.7 GHz
Processor cache type	Smart Cache
Configurable TDP-down	7.5 W
Processor lithography	14 nm
Processor manufacturer	Intel
PCI Express slots version	3.0
Processor boost frequency	3.5 GHz
Processor operating modes	64-bit
PCI Express configurations	1x2+2x1, 1x4, 2x2, 4x1
Thermal Design Power (TDP)	15 W
Configurable TDP-up frequency	2.9 GHz
Configurable TDP-down frequency	0.8 GHz
Maximum number of PCI Express lanes	12
Processor code	SR2ZV
Processor ARK ID	95451
Processor package size	42 x 24 mm
Supported instruction sets	AVX 2.0, SSE4.1, SSE4.2
Intel Identity Protection Technology version	1.00
Intel Stable Image Platform Program (SIPP) version	0.00

Weight and Dimensions

Depth	280 mm
Width	416.8 mm
Height	25.8 mm
Weight	2630 g