HP ProBook 470 G4 Product End-Of-Life Disassembly Instructions

EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screwdriver
#1
Plum Screwdriver
T8
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Relax the screw to disassembly HDD door
2. Remove screw*2 to disassembly HDD assy
3. Remove screw*2 to disassembly KB
4. Remove screw*1 to disassembly ODD assy
5. Remove screw*1 to disassembly Wlan module
6. Removed screw*22, Power FFC, Function FFC, Finger printer FFC,TP FFC, and USB FFC to disassembly Top-assy
and Base assy
7. Remove screw*2 disassembly battery
8. Remove screw*2 disassembly USB daughter board
9. Remove screw*1 to disassembly Fan
10. Remove screw*1 to disassembly Type-C BKT
11. Remove screw*1 to disassembly main board
12. Removed Daughter board & FFC on Top-assy：Power(screw *1), Function(screw *1), TP module(screw *4), Finger
printer
13. Remove screw*2 to disassembly speaker assy
14. Remove screw*5 to disassembly Hinge-up
15. Disassembly LCD Bezel-assy with LCD Cover-assy
16. Remove screw*4 to disassembly Panel
17. Removed screw*2 to disassembly hinge cap
18. Removed screw*8 to disassembly hinge
19. Removed Cable：LVDS、Antenna
20.
21.
22.
23.
24.
25.
26.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

HP ProBook 470 G4 Specifications

General

Form factor	Clamshell
Product type	Laptop
Product color	Silver
Country of origin	China
Memory slots	2x SO-DIMM
Internal memory	8 GB
Memory clock speed	2133 MHz
Internal memory type	DDR4-SDRAM
Maximum internal memory	16 GB
Memory layout (slots x size)	1 x 8 GB
LED backlight	Yes
Display surface	Matt
Display diagonal	17.3 \
Intel segment tagging	Home Office, Small Business
On-board graphics card ID	0x5916
Discrete graphics card model	NVIDIA® GeForce® 930MX
On-board graphics card model	Intel® HD Graphics 620
Discrete graphics card memory	2 GB
Discrete graphics memory type	GDDR3
On-board graphics card family	Intel® HD Graphics
Maximum on-board graphics card memory	32 GB
On-board graphics card OpenGL version	4.4
On-board graphics card base frequency	300 MHz
On-board graphics card DirectX version	12.0
On-board graphics card dynamic frequency (max)	1050 MHz
SSD capacity	The Solid State Drive's storage capacity in Gigabytes.
Storage media	SSD
Optical drive type	DVD Super Multi DL
Total storage capacity	256 GB
Compatible memory cards	SD, SDHC, SDXC
Number of SSDs installed	1
Front camera signal format	720p
Wi-Fi standards	-
Bluetooth version	4.2
Ethernet LAN data rates	10, 100, 1000 Mbit/s
Number of built-in speakers	2
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
USB 3.2 Gen 2 (3.1 Gen 2) Type-A ports quantity	0
Sustainability certificates	EPEAT Gold, ENERGY STAR
Operating shock	40 G
Operating altitude	-15.24 - 3048 m
Non-operating shock	20 G
Operating vibration	0.75 G
Non-operating altitude	-15.24 - 12192 m
Non-operating vibration	1.5 G
Storage temperature (T-T)	-20 - 60 °C
Operating temperature (T-T)	0 - 35 °C
Storage relative humidity (H-H)	5 - 95 %
Operating relative humidity (H-H)	10 - 90 %
AC adapter power	65 W
Battery capacity	48 Wh
Number of battery cells	3
Keyboard layout	QWERTY
Pointing device	Clickpad
Bus type	OPI
Stepping	H0
Tjunction	100 °C
Processor cache	4 MB
System bus rate	4 GT/s
Processor family	Intel® Core™ i7
Processor socket	BGA 1356
Processor threads	4
Processor codename	Kaby Lake
Configurable TDP-up	25 W
Processor frequency	2.7 GHz
Processor cache type	Smart Cache
Configurable TDP-down	7.5 W
Processor lithography	14 nm
Processor manufacturer	Intel
PCI Express slots version	3.0
Processor boost frequency	3.5 GHz
Processor operating modes	64-bit
PCI Express configurations	1x2+2x1, 1x4, 2x2, 4x1
Thermal Design Power (TDP)	15 W
Configurable TDP-up frequency	2.9 GHz
Configurable TDP-down frequency	0.8 GHz
Maximum number of PCI Express lanes	12
Processor code	SR2ZV
Processor ARK ID	95451
Processor package size	42 x 24 mm
Supported instruction sets	AVX 2.0, SSE4.1, SSE4.2
Intel Identity Protection Technology version	1.00
Intel Stable Image Platform Program (SIPP) version	0.00

Weight and Dimensions

Depth	280 mm
Width	416.8 mm
Height	25.8 mm
Weight	2630 g