EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Size (if
applicable)
Torx screwdriver (included with the server)
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. System Board Battery - Remove the top cover and locate the battery on the system board. With a medium flat head
screw driver remove the battery and dispose of properly.
2. Capacitors in 300W power supply=> 2.5 cm () - Remove the power supply from the system with a T-15 torx driver.
With a #2 Philips screw driver remove the screws securing the top cover then locate the capacitors and pry from the
PCB with a flat head screw driver or Long Nose Plier () and dispose of properly.
3. Capacitors in 750W power supply=> 2.5 cm () - Remove the power supply from the system with a T-15 torx driver.
With a #2 Philips screw driver remove the screws securing the top cover then locate the capacitors and pry from the
PCB with a flat head screw driver or Long Nose Plier and dispose of properly.
4.
5. .
6.
7.
8.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
1. Open the locking latch, slide the access panel to the rear of the chassis, and then remove the
access panel.
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